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Shih, Ya-Jung
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1

Complementary Detectors for DUV Sensing by CMOS Logic Techn..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Huang, Ting-Kai ; Yeh, Hsin-Hung ; Shih, Jiaw-Ren.. - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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2

16nm FinFET DUV Detector Array in Fully Compatible FinFET L..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lin, Wei-Hwa ; Shih, Jiaw-Ren ; Chang, Jonathan... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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3

A New Self-Powered Wireless Sensing Circuitry for On-Wafer ..:

, In: 2022 International Electron Devices Meeting (IEDM),
Lin, Wei-Hwa ; Chen, Li Ci ; Ho, Ming-Han... - p. 31.5.1-31.5.4 , 2022
Link: https://doi.org/10.1109/..
 
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4

2T-Pixel Sensors Array for on-Wafer in-Chamber DUV Sensing:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Lin, Wei-Hwa ; Wang, Chien-Ping ; Shih, Jiaw-Ren.. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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5

An Investigation of Plasma Charging Effect on FinFET Front-..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Yang, Kai-Wei ; Chao, Yi-Jie ; Shih, Jiaw-Ren.. - p. 384-386 , 2022
Link: https://doi.org/10.1109/..
 
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6

High Voltage Gain 4H-SIC CMOS Technology Featuring LOCal Ox..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Tsui, Bing-Yue ; Hung, Chia-Lung ; Jhuang, Ya-Ru... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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7

On-Wafer Electronic Layer Detectors Array (ELDA) for e-beam..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Wang, Chien-Ping ; Lin, Bum Jeng ; Shih, Jiaw-Ren... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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8

Hair-Like Nanostructure Based Ion Detector by 16nm FinFET T..:

, In: 2020 IEEE Symposium on VLSI Technology,
Wang, Chien-Ping ; Shen, Ying-Chun ; Liou, Kun-Lin... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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9

Binarization Using Morphological Decomposition Followed by ..:

, In: 2019 IEEE International Conference on Artificial Intelligence and Virtual Reality (AIVR),
Hsieh, Cheng-Pan ; Lee, Shih-Kai ; Liao, Ya-Yi.. - p. 208-2083 , 2019
Link: https://doi.org/10.1109/..
 
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10

Piles of Objects Detection for Grasping System Using Modifi..:

, In: 2023 International Conference on Advanced Robotics and Intelligent Systems (ARIS),
Lin, Bor-Haur ; He, Wei ; Shih, Kai-Jung.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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11

Urban Simulation in UAV, Smartphone, GIS, AR, and RP:

, In: 2023 9th International Conference on Applied System Innovation (ICASI),
Shih, Naai-Jung ; Tasi, Yun-Ting - p. 21-23 , 2023
Link: https://doi.org/10.1109/..
 
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12

Vocabulary Acquisition From a Virtual Street-View Context:

, In: Research Anthology on Virtual Environments and Building the Metaverse,
Shih, Ya-Chun - p. 259-279 , 2022
Link: https://doi.org/10.4018/..
 
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13

Digital Preservation of Old Cultural Elements in AR and VR:

, In: 202020 3rd IEEE International Conference on Knowledge Innovation and Invention (ICKII),
Shih, Naai-Jung ; Chen, Hui-Xu - p. 125-127 , 2020
Link: https://doi.org/10.1109/..
 
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14

Frontend Design for FMCW MIMO Radar Sensor:

, In: 2019 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS),
Lai, Wen-Cheng ; Chen, Wen-Hao ; Shih, Ting-Jung. - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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15

Multi-Access Edge Computing-Assisted D2D Streaming for Prox..:

, In: 2019 IEEE Global Communications Conference (GLOBECOM),
Yang, Shun-Ren ; Shih, Chang-Jung ; Lin, Phone - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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