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Shimizu, T
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1

Conductance change property of the ReRAM with Au-doped HfOx..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Tanaka, M. ; Okayasu, S. ; Shimizu, T... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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2

Visualization of Evaluation Viewpoints in Similar Customers..:

, In: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),
Sasaki, Y. ; Watanabe, R. ; Shimizu, T... - p. 1052-1056 , 2023
Link: https://doi.org/10.1109/..
 
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3

Relaxation of conductance during DC voltage pulse off time ..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Huang, C.Y. ; Tanaka, M. ; Shimizu, T... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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4

Complex Third Order Nonlinear Optical Susceptibility in the..:

, In: 2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz),
Wang, Y.W. ; Phan, T. N. K. ; Shimizu, T.... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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5

Improving the Latency of 5G V2N2V Communications in Multi-M..:

, In: 2022 IEEE 95th Vehicular Technology Conference: (VTC2022-Spring),
Coll-Perales, B. ; Lucas-Estan, M.C. ; Shimizu, T.... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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6

End-to-End Latency of V2N2V Communications under Different ..:

, In: 2022 IEEE 33rd Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC),
Coll-Perales, B. ; Lucas-Estan, M.C. ; Shimizu, T.... - p. 622-627 , 2022
Link: https://doi.org/10.1109/..
 
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7

Pixel Pitch Hybrid Bonding and Three Layer Stacking Technol..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Tanida, K. ; Suzuki, S. ; Seo, T.... - p. 5-7 , 2022
Link: https://doi.org/10.1109/..
 
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8

Interface engineering of BEOL compatible ferroelectric Y:Hf..:

, In: 2020 IEEE International Memory Workshop (IMW),
Molina, J. ; Mimura, T. ; Nakamura, Y.... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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9

Observation of strong yellow emission for high-conductivity..:

, In: 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz),
Nakajima, M. ; Tani, M. ; Idehara, T.... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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10

Cu Diffusion Barrier Properties of Various CoWB Electroless..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Matsudaira, T. ; Shindo, S. ; Shimizu, T.... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Breakthrough in Channel Mobility Limit of Nitrided Gate Ins..:

, In: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Asaba, S. ; Ito, T. ; Fukatsu, S.... - p. 139-142 , 2019
Link: https://doi.org/10.1109/..
 
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12

Effect of W addition for Cu diffusion barrier property of e..:

, In: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC),
Iseri, T. ; Shindo, S. ; Shimizu, T.... - p. 485-488 , 2018
Link: https://doi.org/10.23919..
 
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13

Cell sheet engineering for cardiac repair and regeneration:

, In: Cardiac Regeneration and Repair,
Haraguchi, Y. ; Shimizu, T. ; Matsuura, K.... - p. 225-247 , 2014
Link: https://doi.org/10.1533/..
 
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14

Contributor contact details:

, In: Cardiac Regeneration and Repair,
Li, R.-K. ; Weisel, R.D. ; Xing, M.... - p. xi-xiv , 2014
Link: https://doi.org/10.1016/..
 
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15

Pressurized fluidized bed combustion (PFBC):

, In: Fluidized Bed Technologies for Near-Zero Emission Combustion and Gasification,
Shimizu, T. - p. 669-700 , 2013
Link: https://doi.org/10.1533/..
 
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