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Shin, Hyung-Sik
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1

Based on a size of Microplastics, Multi-Channel Microwave R..:

, In: 2023 IEEE 21st Student Conference on Research and Development (SCOReD),
Lee, Kwon-Hong ; Kim, Jin-Hyoung ; Shin, Kyu-Sik.. - p. 338-341 , 2023
Link: https://doi.org/10.1109/..
 
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2

Improvement of thermal stability of Ni-germanide with co-sp..:

, In: 2011 International Semiconductor Device Research Symposium (ISDRS),
Shin, Hong-Sik ; Oh, Se-Kyung ; Kang, Min-Ho... - p. 1-2 , 2011
Link: https://doi.org/10.1109/..
 
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3

The actuator for high-speed CD/DVD rewritable system:

, In: International Symposium on Optical Memory and Optical Data Storage Topical Meeting,
Byung Youn Song ; Dae Jong Jang ; Do Sun Narn... - p. 353,354,355 , 2002
Link: https://doi.org/10.1109/..
 
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4

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
Link: https://doi.org/10.1109/..
 
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5

13.2 A 32Gb 8.0Gb/s/pin DDR5 SDRAM with a Symmetric-Mosaic ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Choi, Ikjoon ; Hong, Seunghwan ; Kim, Kihyun... - p. 234-236 , 2024
Link: https://doi.org/10.1109/..
 
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6

Monitoring Sleep Posture Based on Temperature and Humidity ..:

, In: 2024 International Conference on Artificial Intelligence in Information and Communication (ICAIIC),
Kim, Hyung-Ju ; Jun, Won-Ho ; Shin, Woo-Chul. - p. 022-025 , 2024
Link: https://doi.org/10.1109/..
 
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7

A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibra..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Park, Myeong-Jae ; Cho, Ho Sung ; Yun, Tae-Sik... - p. 444-446 , 2022
Link: https://doi.org/10.1109/..
 
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8

Efficient Traversability Mapping Based on Single Camera and..:

, In: Intelligent Autonomous Systems 18; Lecture Notes in Networks and Systems,
Youn, Chanmin ; Youn, Wonkeun ; Kim, Sanghyun.. - p. 607-615 , 2024
Link: https://doi.org/10.1007/..
 
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9

A 900V HVIC Process with New Structure of Internal Bootstra..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Shin, Hong-Sik ; Jang, Hyun-Deuk ; Yu, Jin-Tae.. - p. 414-417 , 2024
Link: https://doi.org/10.1109/..
 
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10

Efficient Design and Implementation Method to Reduce NR-bas..:

, In: 2023 Fourteenth International Conference on Ubiquitous and Future Networks (ICUFN),
Jeong, Chan-Bok ; Ju, Hyung-Sik ; Jeon, Young-Il. - p. 917-922 , 2023
Link: https://doi.org/10.1109/..
 
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11

Thick Cu Cylinder CAP Welding with Fiber Laser Under High V..:

, In: 2022 International Conference Laser Optics (ICLO),
Hann, Swook ; Jang, Hyung-Sik ; Choi, Zenith - p. 1-1 , 2022
Link: https://doi.org/10.1109/..
 
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12

PhaRaO: Direct Radar Odometry using Phase Correlation:

, In: 2020 IEEE International Conference on Robotics and Automation (ICRA),
Park, Yeong Sang ; Shin, Young-Sik ; Kim, Ayoung - p. 2617-2623 , 2020
Link: https://doi.org/10.1109/..
 
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13

eBPF/XDP Based Network Traffic Visualization and DoS Mitiga..:

, In: Advances in Internet, Data and Web Technologies; Lecture Notes on Data Engineering and Communications Technologies,
Choe, YoungEun ; Shin, Jun-Sik ; Lee, Seunghyung. - p. 458-468 , 2020
Link: https://doi.org/10.1007/..
 
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14

Korean Technical Innovation: toward Autonomous Ship and Sma..:

, In: Proceedings of the International Seminar on Safety and Security of Autonomous Vessels (ISSAV) and European STAMP Workshop and Conference (ESWC) 2019,
Kwon, Yongwon ; Jeong, Yong-kuk ; Woo, Jong-hun... - p. 83-94 , 2020
Link: https://doi.org/10.2478/..
 
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15

Thermal Analysis of Potted Litz Wire for High-Power-Density..:

, In: 2019 AIAA/IEEE Electric Aircraft Technologies Symposium (EATS),
Woodworth, Andrew A. ; Shin, Euy-Sik ; Smith, Andrew... - p. 1-13 , 2019
Link: https://doi.org/10.2514/..
 
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