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Shin, Wooyoung
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1

A New Evaluation Method of Bonding Strength Using Atomic Fo..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Shin, Donggap ; Moon, Bumki ; Lee, Yongin... - p. 350-353 , 2023
Link: https://doi.org/10.1109/..
 
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2

Contamination-Free Cu/SiCN Hybrid Bonding Process Developme..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hahn, Seung Ho ; Kim, Wooyoung ; Shin, Donggap... - p. 1390-1396 , 2023
Link: https://doi.org/10.1109/..
 
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3

Copper contamination control in Hybrid Copper Bonding:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Kim, Wooyoung ; Han, Seung Ho ; Lee, Yongin... - p. 41-42 , 2023
Link: https://doi.org/10.23919..
 
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4

First Demonstration of Innovative 3D AND-Type Fully-Paralle..:

, In: 2023 International Electron Devices Meeting (IEDM),
Kim, Jangsaeng ; Im, Jiseong ; Ko, Jonghyun... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Learning Time-Frequency Representations of Phonocardiogram ..:

, In: 2022 Computing in Cardiology (CinC),
Shin, Jae-Man ; Park, Seong-Yong ; Kim, Hyun-Seok.. - p. 1-4 , 2022
Link: https://doi.org/10.22489..
 
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6

Molecular Dynamics Study on Plasma-Surface Interactions of ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hahn, Seung Ho ; Kim, Wooyoung ; Shin, Donggap... - p. 527-533 , 2022
Link: https://doi.org/10.1109/..
 
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7

Deep learning-based defective product classification system..:

, In: The 9th International Conference on Smart Media and Applications,
Nguyen, Huy Toan ; Shin, Nu-ri ; Yu, Gwang-Hyun... - p. 80-85 , 2020
Link: https://dl.acm.org/doi/1..
 
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8

Target motion analysis with evolutionary search by fusion o..:

, In: 2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI),
Shin, Hyunhak ; Hong, Wooyoung ; Kim, Ria. - p. 247-252 , 2017
Link: https://doi.org/10.1109/..
 
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9

Multi-body dynamics simulations of high speed transfer robo..:

, In: 2017 14th International Conference on Ubiquitous Robots and Ambient Intelligence (URAI),
Shin, Dong-Hwan ; Jin, Sungho ; Lee, Seonghun... - p. 253-254 , 2017
Link: https://doi.org/10.1109/..
 
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10

Mechanical analysis of mass drifts due to accelerations and..:

, In: 2017 14th International Conference on Ubiquitous Robots and Ambient Intelligence (URAI),
Shin, Dong-Hwan ; Jin, Sungho ; Bae, Junhyung... - p. 255-257 , 2017
Link: https://doi.org/10.1109/..
 
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11

Dendritic palladium-silver nano-structure grown by electroc..:

, In: 2008 58th Electronic Components and Technology Conference,
Lee, Shin-Bok ; Lee, Eunsongyi ; Lee, Wooyoung. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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