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Vibration Engineering for a Sustainable Future ,
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Estimation of the Main Transfer Function of Ultrasonic Tran..:
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Connecting the Library to the Curriculum ,
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Broadening Students' Employability Horizons: A Korean Studi..:
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2024 IEEE 21st Biennial Conference on Electromagnetic Field Computation (CEFC) ,
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Performance Prediction Process of Outer Rotor PMSM Through ..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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6.10 A 1/1.56-inch 50Mpixel CMOS Image Sensor with 0.5μm pi..:
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Intelligent Autonomous Systems 18; Lecture Notes in Networks and Systems ,
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A Machine Learning-Based Blood Volume Classification Model ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Finite Element Modeling for Wafer-to-Wafer Direct Bonding B..:
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Companion Proceedings of the ACM on Web Conference 2024 ,
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AISG's Online Safety Prize Challenge: Detecting Harmful Soc..:
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2023 23rd International Conference on Control, Automation and Systems (ICCAS) ,
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Recovery Direction Classification: Reduced Order Quadrotor ..:
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2023 International Electron Devices Meeting (IEDM) ,
12
Highly Manufacturable, Cost-Effective, and Monolithically S..:
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2023 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC) ,
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Ag Ink-Jet Printed CPW with Micro-Surface Cavities: Effects..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 1-Tb, 4b/Cell, 176-Stacked-WL 3D-NAND Flash Memory with I..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
15