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Son, Young-Don
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1

PET Denoising and Uncertainty Estimation Based on NVAE Mode..:

, In: Lecture Notes in Computer Science; Medical Image Computing and Computer Assisted Intervention – MICCAI 2022,
Cui, Jianan ; Xie, Yutong ; Joshi, Anand A.... - p. 173-183 , 2022
Link: https://doi.org/10.1007/..
 
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2

Residual Simplified Reference Tissue Model with Covariance ..:

, In: 2020 IEEE 17th International Symposium on Biomedical Imaging (ISBI),
Kim, Kyungsang ; Hong, Inki ; Son, Young Don.. - p. 777-780 , 2020
Link: https://doi.org/10.1109/..
 
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3

Penalized PET Reconstruction using CNN Prior:

, In: 2017 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC),
Kim, Kyungsang ; Wu, Dufan ; Gong, Kuang... - p. 1-4 , 2017
Link: https://doi.org/10.1109/..
 
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4

The effects of the clearance in the cold finger on the perf..:

, In: Proceedings of the Twentieth International Cryogenic Engineering Conference (ICEC20),
Hong, Yong-Ju ; Koh, Deuk-Yong ; Park, Seong-Je.. - p. 141-144 , 2005
Link: https://doi.org/10.1016/..
 
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5

A low-power graphics LSI integrating 29Mb embedded DRAM for..:

, In: Proceedings of the 2004 Asia and South Pacific Design Automation Conference,
Woo, Ramchan ; Choi, Sungdae ; Sohn, Ju-Ho... - p. 533-534 , 2004
Link: https://dl.acm.org/doi/1..
 
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6

Underfill Selection Guideline for Fan-Out Heterogeneous Int..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Teng, Wen-Yu ; Hung, Liang-Yih ; Lee, Jackson... - p. 1993-1997 , 2024
Link: https://doi.org/10.1109/..
 
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7

Stress and Reliability of Underfills in Heterogeneous Integ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Hung, Liang-Yih.. - p. 235-236 , 2023
Link: https://doi.org/10.23919..
 
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8

3DIC Stacking Process Investigation by Soldering Bonding Te..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Li, Jay ; Jhen Chen, Wei ; Lin, Joe... - p. 1121-1125 , 2022
Link: https://doi.org/10.1109/..
 
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9

Stress and Reliability Challenges of Underfills in Large-Si..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Tseng, Hsin-Ming... - p. 225-226 , 2022
Link: https://doi.org/10.23919..
 
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10

The Hybrid Stack-up with PTFE 5G Mm-Wave Antenna in Package..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lu, Ying-Wei ; Fang, Bo-Siang ; Chen, Kuan-Ta.. - p. 368-371 , 2019
Link: https://doi.org/10.1109/..
 
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11

Anatomical Consideration of Posterior Cervical Endoscopic A..:

, In: Advanced Technique of Endoscopic Cervical and Thoracic Spine Surgery,
Heo, Dong Hwa ; Jang, Jae Won ; Park, Don Young - p. 3-10 , 2023
Link: https://doi.org/10.1007/..
 
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12

Biportal Endoscopic Posterior Cervical Foraminotomy and Dis..:

, In: Advanced Technique of Endoscopic Cervical and Thoracic Spine Surgery,
Heo, Dong Hwa ; Hong, Hyun Jin ; Park, Don Young. - p. 119-128 , 2023
Link: https://doi.org/10.1007/..
 
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13

Biportal Endoscopic Lumbar Interbody Fusion:

, In: Core Techniques of Minimally Invasive Spine Surgery,
Heo, Dong Hwa ; Park, Don Young ; Hong, Young Ho - p. 167-175 , 2023
Link: https://doi.org/10.1007/..
 
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14

Chondrosarcoma of the Axial Skeleton:

, In: Chondrosarcoma,
Shah, Akash A. ; Park, Howard Young ; Blumstein, Gideon. - p. 113-132 , 2021
Link: https://doi.org/10.1007/..
 
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15

Low-Grade Spinal Malignancies: Chordoma and Chondrosarcoma:

, In: Surgical Spinal Oncology,
Blumstein, Gideon ; Kelley, Benjamin ; Nelson, Scott.. - p. 89-113 , 2020
Link: https://doi.org/10.1007/..
 
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