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Su, Huei-Meei
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results:
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1
Assembly and reliability of micro-bumped chips with Through..:
, In:
2009 11th Electronics Packaging Technology Conference
,
Ong, Yue Ying
;
Chai, Tai Chong
;
Yu, Daquan
... - p. None , 2009
Link:
https://doi.org/10.1109/..
1-1
