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Sun, X P
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1

Analysis on the Influencing Factors of Sediment Deposition ..:

, In: APAC 2019,
Zhang, X. Z. ; Sun, J. ; Zhao, X. D.... - p. 311-316 , 2019
Link: https://doi.org/10.1007/..
 
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2

List of contributors:

, In: Advances in Batteries for Medium and Large-Scale Energy Storage,
Bresser, D. ; Brown, G.M. ; Chan, S.L.I.... - p. xi-xiii , 2015
Link: https://doi.org/10.1016/..
 
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3

Limit loads for cracked elbows under in-plane bending momen:

, In: International Conference on Advanced Technology of Design and Manufacture (ATDM 2010),
Wang, C. ; Wang, Y. P. ; Li, P. N... - p. 493-497 , 2010
Link: https://doi.org/10.1049/..
 
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4

Lack of association between apolipoprotein E promoters in 4..:

, In: Cerebral Hemorrhage; Acta Neurochirurgica Supplementum,
Jiang, Y. ; Sun, X. C. ; Gui, L.... - p. 233-236 ,
Link: https://doi.org/10.1007/..
 
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5

Performance Evaluation of a Next-generation Human Brain PET..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Sun, X. ; Badawi, R. D. ; Cherry, S. R.... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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6

Validation and application of markerless head motion tracki..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Zeng, T. ; Wang, S. ; Fontaine, K.... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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7

Development and initial evaluation of 3D-printed ultra-high..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Toyonaga, T. ; Shanina, E. ; Lo, C.... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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8

Neural network fuzzy control for semi-active suspension sys..:

, In: International Conference on Electric Vehicle and Vehicle Engineering (CEVVE 2023),
Lu, J. ; Sun, X. ; Wong, P. K. - p. None , 2023
Link: https://doi.org/10.1049/..
 
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9

III-V/III-N technologies for next generation high-capacity ..:

, In: 2022 International Electron Devices Meeting (IEDM),
Collaert, N. ; Alian, A. ; Banerjee, A.... - p. 11.5.1-11.5.4 , 2022
Link: https://doi.org/10.1109/..
 
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10

Simulation and optimization of honeycomb sandwich panel str..:

, In: 1st International Conference on Mechanical System Dynamics (ICMSD 2022),
Fu, T. ; Zhou, D. ; Zheng, Q.... - p. None , 2022
Link: https://doi.org/10.1049/..
 
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11

Stepwise estimation of harmonic state based on hybrid measu..:

, In: 18th International Conference on AC and DC Power Transmission (ACDC 2022),
Shen, P. ; Zhang, H. ; Sun, X... - p. None , 2022
Link: https://doi.org/10.1049/..
 
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12

(Why do we need) Wireless Heterogeneous Integration (anyway..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Peeters, M. ; Sinha, S. ; Sun, X.... - p. 256-257 , 2022
Link: https://doi.org/10.1109/..
 
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13

Cost-effective RF interposer platform on low-resistivity Si..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sun, X. ; Slabbekoorn, J. ; Sinha, S.... - p. 7-11 , 2022
Link: https://doi.org/10.1109/..
 
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14

Adsorption of arsenic by birnessite-loaded biochar in water..:

, In: Environmental Arsenic in a Changing World,
Wang, H.Y. ; Chen, P. ; Sun, G.X. - p. 245-246 , 2019
Link: https://doi.org/10.1201/..
 
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15

TSV-assisted hybrid FinFET CMOS — Silicon Photonics Technol..:

, In: 45th European Conference on Optical Communication (ECOC 2019),
Guermandi, D. ; Bogaerts, L. ; Rakowski, M.... - p. 1-4 , 2019
Link: https://doi.org/10.1049/..
 
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