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SI/PI Co-Simulation Analysis of High-Speed I/O Link:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),

Sun, Liang ; Miao, Min ; Li, Tao. - p. 1-5 , 2022

Link: https://doi.org/10.1109/..

2

Co-design and Signal-Power Integrity/EMI Co-analysis of a S..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Miao, Min ; Duan, Xiaolong ; Sun, Liang... - p. 1329-1336 , 2022

Link: https://doi.org/10.1109/..

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