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Tan, Keith
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1

The Survival of Cultural Patterns in Malaysia's Contemporar..:

, In: Contemporary Asian Artistic Expressions and Tourism; Perspectives on Asian Tourism,
Blankenship, Sherry Fresia ; Tan, Keith Kay Hin - p. 147-167 , 2020
Link: https://doi.org/10.1007/..
 
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2

Contemporary Asian Artistic Expressions and Tourism – An In..:

, In: Contemporary Asian Artistic Expressions and Tourism; Perspectives on Asian Tourism,
Mura, Paolo ; Tan, Keith Kay Hin ; Choy, Chun Wei - p. 1-13 , 2020
Link: https://doi.org/10.1007/..
 
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3

Merging Batik and Stained Glass: Creating Contemporary Asia..:

, In: Contemporary Asian Artistic Expressions and Tourism; Perspectives on Asian Tourism,
Tan, Keith Kay Hin ; Choy, Chun Wei - p. 191-211 , 2020
Link: https://doi.org/10.1007/..
 
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4

'Academic Tourism' and Art: Student Submissions as a Means ..:

, In: Contemporary Asian Artistic Expressions and Tourism; Perspectives on Asian Tourism,
Tan, Keith Kay Hin ; Lee, Sze Ee ; Choy, Chun Wei - p. 39-57 , 2020
Link: https://doi.org/10.1007/..
 
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5

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Fre..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhou, Jiye ; Tan, Xin F. ; McDonald, Stuart D.... - p. 81-82 , 2024
Link: https://doi.org/10.23919..
 
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6

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloy:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Tan, Xin F. ; Hao, Qichao ; Zhou, Jiye... - p. 207-208 , 2024
Link: https://doi.org/10.23919..
 
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7

The Effects of Solution Treatment and Room Temperature Agei..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Ye, Xiaozhou ; Tao, Lei ; McDonald, Stuart D.... - p. 215-216 , 2023
Link: https://doi.org/10.23919..
 
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8

Comparison of the Mechanical Properties of Conventional Pb-..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Hao, Qichao ; Tan, Xin Fu ; McDonald, Stuart D.... - p. 173-174 , 2022
Link: https://doi.org/10.23919..
 
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9

Physical Adversarial Attacks in Simulated Environments:

, In: 2021 IEEE Applied Imagery Pattern Recognition Workshop (AIPR),
Threet, Michael ; Busho, Colin ; Harguess, Josh... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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10

TACK : Improving Wireless Transport Performance by Tamin..:

, In: Proceedings of the Annual conference of the ACM Special Interest Group on Data Communication on the applications, technologies, architectures, and protocols for computer communication,
Li, Tong ; Zheng, Kai ; Xu, Ke... - p. 15-30 , 2020
Link: https://dl.acm.org/doi/1..
 
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11

Stress and Strain Level Evolution and Correlation to Void M..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Newman, Keith ; Lee, Tae-Kyu ; Tan, Gek Joo. - p. 570-573 , 2019
Link: https://doi.org/10.1109/..
 
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12

Part Two: Public investment – Prioritising society rather t..:

, In: Rethinking Britain,
Konzelmann, Sue ; Fovargue-Davies, Marc ; Andreoni, Antonio... - p. 57-98 , 2019
Link: https://doi.org/10.56687..
 
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13

Contributors:

, In: Accelerated Predictive Stability,
Agrawal, Anjali ; Altan, Stan ; Baertschi, Steven W.... - p. xvii-xix , 2018
Link: https://doi.org/10.1016/..
 
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14

Contributors:

, In: Managing Agricultural Greenhouse Gases,
Adler, Paul R. ; Alfieri, Joseph G. ; Alig, Ralph... - p. xix-xxv , 2012
Link: https://doi.org/10.1016/..
 
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15

List of contributors:

, In: Translational Sports Medicine,
Abboud, Joseph ; Akhnoukh, Kyrillos M. ; Alexandrov, Alexander... - p. xiii-xix , 2023
Link: https://doi.org/10.1016/..
 
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