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Tan, Y.P
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1

A Short Review: Reliability Issues of Lead-Free Sn-Based Al..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
Tan, Y. P. ; Somidin, F. - p. 63-71 , 2023
Link: https://doi.org/10.1007/..
 
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2

Feature Extraction from Moiré Pattern Images for Tilt Sensi..:

, In: Proceedings of the International Conference on Imaging, Signal Processing and Communication,
Tan, P. Y. ; Ratnam, M. M. ; Ahmad, F. - p. 24-29 , 2017
Link: https://dl.acm.org/doi/1..
 
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3

Treemap - The Fast Routing Convergence Method for Applicati..:

, In: 2010 7th IEEE Consumer Communications and Networking Conference,
Phan, Khoa T. ; Thoai, Nam ; Muramoto, Eiichi... - p. None , 2010
Link: https://doi.org/10.1109/..
 
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4

CMOS shallow trench isolation x-stress effect on channel wi..:

, In: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.,
Tan, P.B.Y. ; Kordesch, A.V. ; Sidek, O. - p. 319,320 , 2004
Link: https://doi.org/10.1109/..
 
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5

Reliability acceptance test plan based on multi-level infor..:

, In: 12th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2022),
Zhao, Q. ; Tan, Y. ; Jiang, P... - p. None , 2022
Link: https://doi.org/10.1049/..
 
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6

Type-I censored reliability acceptance plan for weibull dis..:

, In: 12th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2022),
Tan, Y. ; Zhao, Q. ; Jiang, P... - p. None , 2022
Link: https://doi.org/10.1049/..
 
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7

Contributor contact details:

, In: Rare Earth-Based Corrosion Inhibitors,
Forsyth, M. ; Hinton, B. ; Behrsing, T.... - p. xi-xiii , 2014
Link: https://doi.org/10.1016/..
 
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8

III-V MOSFETs: Scaling laws, scaling limits, fabrication pr..:

, In: 2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM),
Rodwell, M. J. W. ; Shin, B. ; Lee, Yong-ju... - p. 1-6 , 2010
Link: https://doi.org/10.1109/..
 
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9

Record-Low Metal to Semiconductor Contact Resistance in Ato..:

, In: 2023 International Electron Devices Meeting (IEDM),
Niu, C. ; Lin, Z. ; Zhang, Z.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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10

Contributors:

, In: Decision Making in Water Resources Policy and Management,
Auty, K. ; Barlow, C. ; Bekessy, S.A.... - p. xv-xvii , 2017
Link: https://doi.org/10.1016/..
 
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11

Contributor contact details:

, In: Delamination Behaviour of Composites,
Sridharan, S. ; Raju, I.S. ; O'Brien, T.K.... - p. xv-xx , 2008
Link: https://doi.org/10.1016/..
 
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12

Aggressively Scaled High-k Gate Dielectric with Excellent P..:

, In: 2007 IEEE International Electron Devices Meeting,
Sivasubramani, P. ; Harris, R. ; Song, S.C.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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13

Novel and Simple Cross-sectional FIB Circuit Edit Technique..:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Tan, P. K. ; Pan, Y. L. ; Ting, S. L.... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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14

PSTN Enterprise Collaboration Systems:

, In: Pervasive Computing and Social Networking; Lecture Notes in Networks and Systems,
JosephNg, P. S. ; Yeo, R. C. ; Wong, J. H.... - p. 803-816 , 2022
Link: https://doi.org/10.1007/..
 
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15

Sample Preparation in Recover Physical Defects on MIM Relat..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Ng, H. P. ; Xu, N.Y. ; Nagalingam, D.... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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