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Teng, Yu-Xian
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1

Photon-number Resolving Detection Based on High Efficiency ..:

, In: 2022 IEEE Photonics Conference (IPC),
Chen, Chi-En ; Kan, Wei-Hong ; Shi, Jin-Wei... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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2

Anomaly Detection in Dynamic Networks using Multi-view Time..:

, In: Proceedings of the 2017 ACM on Conference on Information and Knowledge Management,
Teng, Xian ; Lin, Yu-Ru ; Wen, Xidao - p. 827-836 , 2017
Link: https://dl.acm.org/doi/1..
 
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3

High thermal conductive Graphene-based Composites and its C..:

, In: 2023 45th Annual EOS/ESD Symposium (EOS/ESD),
Lin, Rong-Teng ; Wu, Bi-Xian ; Yang, Yun-Hong... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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4

Contributors:

, In: Circularity of Plastics,
Chai, Casandra Hui Teng ; Chan, Chui Yu ; Chen, Guo-Qiang... - p. xi-xiii , 2023
Link: https://doi.org/10.1016/..
 
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5

Converting plastic waste to fuel and fine chemicals:

, In: Circularity of Plastics,
Chai, Casandra Hui Teng ; Chan, Chui Yu ; Heng, Jerry Zhi Xiong... - p. 71-100 , 2023
Link: https://doi.org/10.1016/..
 
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6

Requirements for the Development of a Performance Managemen..:

, In: Lecture Notes in Mechanical Engineering; Manufacturing Driving Circular Economy,
Teng, Yu-Min ; Ay, Sila ; Iyer, Rishabh. - p. 1091-1098 , 2023
Link: https://doi.org/10.1007/..
 
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7

DeepEye: Design and Implementation of Embedded System for E..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Chen, Shou-Hsuan ; Chen, Hsing-Yi ; Cheng, Ya-Mien... - p. 759-760 , 2023
Link: https://doi.org/10.1109/..
 
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8

Learning Deterministic Multi-Clock Timed Automata:

, In: Proceedings of the 27th ACM International Conference on Hybrid Systems: Computation and Control,
Teng, Yu ; Zhang, Miaomiao ; An, Jie - p. 1-11 , 2024
Link: https://dl.acm.org/doi/1..
 
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9

Underfill Selection Guideline for Fan-Out Heterogeneous Int..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Teng, Wen-Yu ; Hung, Liang-Yih ; Lee, Jackson... - p. 1993-1997 , 2024
Link: https://doi.org/10.1109/..
 
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10

Advanced TIM Material Analysis for High Performance Package..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Jhan, Jyun-De ; Teng, Wen-Yu ; Hung, Liang-Yih.. - p. 229-230 , 2024
Link: https://doi.org/10.23919..
 
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11

Investigation of Solder Resist Opening Uniformity on Flip C..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Ni, Yuan-Chang ; Teng, Wen-Yu ; Pai, Yu-Cheng.. - p. 255-256 , 2023
Link: https://doi.org/10.23919..
 
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12

Stress and Reliability of Underfills in Heterogeneous Integ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Hung, Liang-Yih.. - p. 235-236 , 2023
Link: https://doi.org/10.23919..
 
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13

Edge Fusion of Intelligent Industrial Park Based on MatrixO..:

, In: 2023 IEEE International Symposium on Broadband Multimedia Systems and Broadcasting (BMSB),
Yan, Jingwei ; Liu, Yitong ; Qin, Shuqi... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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14

Study of Solder Resist Crack Resistance for Flip Chip Ball ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Eric ; Ye, Rick ; Teng, Wen-Yu.. - p. 1531-1535 , 2023
Link: https://doi.org/10.1109/..
 
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15

Effect of Underfill Additive Agents on Crack Prevention in ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Ching-Chia ; Teng, Wen-Yu ; Tsai, Fang Lin... - p. 477-480 , 2022
Link: https://doi.org/10.1109/..
 
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