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2022 IEEE Photonics Conference (IPC) ,
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Photon-number Resolving Detection Based on High Efficiency ..:
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Proceedings of the 2017 ACM on Conference on Information and Knowledge Management ,
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Anomaly Detection in Dynamic Networks using Multi-view Time..:
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2023 45th Annual EOS/ESD Symposium (EOS/ESD) ,
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High thermal conductive Graphene-based Composites and its C..:
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Lecture Notes in Mechanical Engineering; Manufacturing Driving Circular Economy ,
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Requirements for the Development of a Performance Managemen..:
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2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
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DeepEye: Design and Implementation of Embedded System for E..:
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Proceedings of the 27th ACM International Conference on Hybrid Systems: Computation and Control ,
8
Learning Deterministic Multi-Clock Timed Automata:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Underfill Selection Guideline for Fan-Out Heterogeneous Int..:
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2024 International Conference on Electronics Packaging (ICEP) ,
10
Advanced TIM Material Analysis for High Performance Package..:
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2023 International Conference on Electronics Packaging (ICEP) ,
11
Investigation of Solder Resist Opening Uniformity on Flip C..:
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2023 International Conference on Electronics Packaging (ICEP) ,
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Stress and Reliability of Underfills in Heterogeneous Integ..:
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2023 IEEE International Symposium on Broadband Multimedia Systems and Broadcasting (BMSB) ,
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Edge Fusion of Intelligent Industrial Park Based on MatrixO..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Study of Solder Resist Crack Resistance for Flip Chip Ball ..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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