Tomita, Takahiro
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1

Advanced Under-Bump-Metal Scaling Solder Micro-Bump Interco..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
 
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3

List of contributors:

, In: Nanomagnetic Materials,
Elphick, Kelvin ; Fischer, Peter ; Frost, William... - p. xxi-xxvi , 2021
 
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4

Development of bed-type ultrasound diagnosis and therapeuti..:

, In: 2019 IEEE International Conference on Cyborg and Bionic Systems (CBS),
Kobayashi, Kento ; Sasaki, Yudai ; Eura, Fumio... - p. 171-176 , 2019
 
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6

List of Contributors:

, In: Stem Cells and Cancer in Hepatology,
Aoki, Shigehisa ; Chen, Qiwen ; Chikada, Hiromi... - p. xv-xvi , 2018
 
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7

1200V-Class HVIC technology with a divided high-side well s..:

, In: 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD),
 
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8

Histopathological Classification:

, In: Medical Radiology; Imaging of Kidney Cancer,
 
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