Tsai, Frank
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1

CONTRIBUTORS:

, In: Handbook of Dialysis Therapy,
 
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2

The design and implementation of WiMAX module for ns-2 simu..:

, In: Proceeding from the 2006 workshop on ns-2: the IP network simulator,
 
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3

Prediction of Spatial Fluoride Concentrations by a Hybrid A..:

, In: GIS and Geostatistical Techniques for Groundwater Science,
 
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4

Contributors:

, In: GIS and Geostatistical Techniques for Groundwater Science,
Anand Krishnan, R. ; Anbazhagan, S. ; Anirudhan, S.... - p. xiii-xiv , 2019
 
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5

Impact of Phase-Change Memory Drift on Energy Efficiency an..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Frank, Martin M. ; Li, Ning ; Rasch, Malte J.... - p. 1-10 , 2023
 
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6

Design of Analog-AI Hardware Accelerators for Transformer-b..:

, In: 2023 International Electron Devices Meeting (IEDM),
Burr, G. W. ; Tsai, H. ; Simon, W.... - p. 1-4 , 2023
 
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8

Architectures and Circuits for Analog-memory-based Hardware..:

, In: 2023 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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9

A Machine Learning-Based Model for Predicting the Risk of C..:

, In: Advanced Information Networking and Applications; Lecture Notes in Networks and Systems,
Hsiao, Chiu-Han ; Yu, Po-Chun ; Hsieh, Chia-Ying... - p. 364-374 , 2022
 
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10

Real-Time Vehicle Counting by Deep-Learning Networks:

, In: 2022 International Conference on Machine Learning and Cybernetics (ICMLC),
 
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11

Automatic Kidney Volume Estimation System Using Transfer Le..:

, In: Advanced Information Networking and Applications; Lecture Notes in Networks and Systems,
 
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12

EMI Shielding Technology in 5G RF System in Package Module:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Li, Jay ; Tsai, Mike ; Chiu, Ryan... - p. 931-937 , 2020
 
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13

27-fs, 166-MW Pulses at 98 W Average Power from Highly Effi..:

, In: 2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC),
Tsai, Chia-Lun ; Meyer, Frank ; Omar, Alan... - p. 1-1 , 2019
 
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14

High Power Large Size HFCBGA Thermal Characterization:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hu, Ian ; Tsai, Jung-Che ; Cheng, Frank... - p. 467-471 , 2019
 
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15

Innovative EMI Shielding Solutions on Advanced SiP Module f..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Tsai, Mike ; Chiu, Ryan ; He, Eric... - p. 601-607 , 2019
 
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