Tseng, Chin-Hao
199  results:
Search for persons X
?
1

Photonic Microwave Amplification Using Optically Injected S..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,
 
?
2

Photonic Generation of Tunable Sub-THz Signals Using Two Se..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,
 
?
3

All-optical sub-THz signal generation using two mutually co..:

, In: 2023 Optical Fiber Communications Conference and Exhibition (OFC),
 
?
4

High-Gain, Narrow-Band Optical Amplification for Photonic M..:

, In: 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC),
 
?
5

Photonic microwave generation using period-one nonlinear dy..:

, In: 2022 IEEE International Topical Meeting on Microwave Photonics (MWP),
 
?
6

High-Frequency Microwave Generation Using Period-One Dynami..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
 
?
7

12-Gb/s Sub-THz Wireless-over-Fiber Links Using Optically I..:

, In: 2021 Opto-Electronics and Communications Conference (OECC),
 
?
8

Mcirowave chaos generation with 32-GHz bandwidth using opti..:

, In: 2020 Opto-Electronics and Communications Conference (OECC),
 
?
9

Photonic Generation of Linearly Chirped Microwave Signals U..:

, In: 2019 24th OptoElectronics and Communications Conference (OECC) and 2019 International Conference on Photonics in Switching and Computing (PSC),
 
?
10

Malignant Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Hu, Ming-Luen ; Chiu, Yi-Chun ; Tai, Wei-Chen... - p. 19-45 , 2023
 
?
11

Using Reverse-Trapezoid Cantilevers and Sealed Back-Chamber..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Tseng, Chin ; Wei, Ting-Chou ; Lin, Chia-Hao.. - p. 721-724 , 2024
 
?
12

Bandwidth Enhancement of Piezoelectric MEMS Microspeaker Vi..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lin, Chia-Hao ; Wei, Ting-Chou ; Tseng, Chin... - p. 713-716 , 2024
 
?
13

Integration of networked embedded systems into power equipm..:

, In: 2004 IEEE Region 10 Conference TENCON 2004.,
Jen-Hao Teng ; Chin-Yuan Tseng ; Yu-Hung Chen - p. 566,567,568,569 , 2004
 
?
14

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
?
15

HeadWind: Enhancing Teleportation Experience in VR by Simul..:

, In: Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems,
Tseng, Chun-Miao ; Chen, Po-Yu ; Lin, Shih Chin... - p. 1-11 , 2022
 
1-15