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Tseng, Chun-Hsiang
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1

Pesticide Residue Testing System for Fruits and Vegetables ..:

, In: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW),
Lee, Chang-Chi ; Liu, Yu-Sung ; Tseng, Chun-Hsiang... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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2

Magnetic-Free Radio Frequency Circulators Using Bulk Acoust..:

, In: 2023 Asia-Pacific Microwave Conference (APMC),
Lin, Hsin-Han ; Sung, Jung-Pang ; Yu, Ming-Lun... - p. 711-713 , 2023
Link: https://doi.org/10.1109/..
 
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3

10 dB Sensitivity Improvement by Employing Volterra Equaliz..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Su, Yu-Cheng ; Chuang, Chun-Yen ; Tseng, Yen-Hsiang... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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4

CMOS Chip for Solid-State Tactile Force Sensor:

, In: 2020 IEEE Sensors,
Yeh, Sheng-Kai ; Ning, Chao-Chun ; Yeh, Chih-Yuan... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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5

Reconfigurable MAC Systolic Array Architecture Design for T..:

, In: 2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Lin, Shu-Yen ; Lin, Kuan-Han ; Tsai, Chun-Kuan. - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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6

A Low-Loss Balun-Embedded Interconnect for THz Heterogeneou..:

, In: 2020 IEEE/MTT-S International Microwave Symposium (IMS),
Chiu, Te-Yen ; Lee, Yu-Ling ; Ko, Chun-Lin.. - p. 1043-1046 , 2020
Link: https://doi.org/10.1109/..
 
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7

A Novel Polymer-Based Ultra-High Density Bonding Interconne..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Yang, Tsung-Yu Ou ; Lee, Ou-Hsiang... - p. 1779-1784 , 2023
Link: https://doi.org/10.1109/..
 
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8

Vascular Disorders of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Hsu, Wen-Hung ; Yu, Fang-Jung ; Wu, Deng-Chyang... - p. 69-84 , 2023
Link: https://doi.org/10.1007/..
 
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9

Based on DICOM RT Structure and Multiple Loss Function Deep..:

, In: IFMBE Proceedings; Future Trends in Biomedical and Health Informatics and Cybersecurity in Medical Devices,
Hsieh, Ya-Ju ; Tseng, Hsien-Chun ; Chin, Chiun-Li.. - p. 428-435 , 2019
Link: https://doi.org/10.1007/..
 
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10

Level-of-detail representation of bidirectional texture fun..:

, In: Proceedings of the 2005 symposium on Interactive 3D graphics and games,
Ma, Wan-Chun ; Chao, Sung-Hsiang ; Tseng, Yu-Ting... - p. 187-194 , 2005
Link: https://dl.acm.org/doi/1..
 
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11

Satisfiability Modulo Theories-Based Qubit Mapping for Trap..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Tseng, Wei-Hsiang ; Chang, Yao-Wen ; Jiang, Jie-Hong Roland - p. 245-253 , 2024
Link: https://dl.acm.org/doi/1..
 
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12

Highly Reliable PUF Circuits Using Efficient Post-Processin..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Tseng, Yu-Hsiang ; Yang, Shao-Hong ; Liu, Tsung-Te - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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13

The Impact of Hands-on Activities Integrating Design Thinki..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Tseng, Pin-Hsiang ; Xu, Chen-Yin ; Chang, Chi-Cheng - p. 163-173 , 2023
Link: https://doi.org/10.1007/..
 
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14

Enhancing EEG Artifact Removal Efficiency by Introducing De..:

, In: 2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
Chang, Kong-Yi ; Huang, Yung-Chia ; Chuang, Chun-Hsiang - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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15

Demonstration of PtMn-based Field-free Switching SOT MRAM:

, In: 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers),
Lin, Chia-Ping ; Tseng, Chih-Hsiang ; Yen, Yu-Shen... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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