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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Reliability of Heterogeneous Integration on Hybrid Substrat..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Characterization of Low Loss Dielectric Materials for High-..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Hete..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
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Non-Planarization Cu-Cu Direct Bonding and Gang Bonding wit..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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