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Tseng, Tzyy-Guey
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1

Reliability of Heterogeneous Integration on Hybrid Substrat..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yang, Channing Cheng-Lin ; Lau, John H ; Peng, Andy Yan-Jia... - p. 542-547 , 2023
Link: https://doi.org/10.1109/..
 
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2

Characterization of Low Loss Dielectric Materials for High-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Tzu Nien ; Lau, John H ; Ko, Cheng-Ta... - p. 2222-2229 , 2022
Link: https://doi.org/10.1109/..
 
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3

2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Hete..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chen, Gary Chang-Fu ; Lau, John H ; Yang, Channing Cheng-Lin... - p. 30-37 , 2022
Link: https://doi.org/10.1109/..
 
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4

Non-Planarization Cu-Cu Direct Bonding and Gang Bonding wit..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Chou, Tzu-Chieh ; Yang, Kai-Ming ; Li, Jian-Chen... - p. 5.5.1-5.5.4 , 2019
Link: https://doi.org/10.1109/..
 
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5

Using Flexible Hybrid Electronics on a Miniaturized Non-inv..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Yu-Chil ; Yu, Kai-Lun ; Tsai, Shu-An... - p. 201-207 , 2024
Link: https://doi.org/10.1109/..
 
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