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Tseng, Ya-Ting
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1

Multi-view Classifier and Fast Brain Tumor Segmentation Usi..:

, In: 2023 IEEE 16th International Conference on Nano/Molecular Medicine & Engineering (NANOMED),
Liang, Hsuan-Ya ; Chiang, Yu-Hsuan ; Lin, Ya-Chun... - p. 173-178 , 2023
Link: https://doi.org/10.1109/..
 
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2

Orbeez-SLAM: A Real-time Monocular Visual SLAM with ORB Fea..:

, In: 2023 IEEE International Conference on Robotics and Automation (ICRA),
Chung, Chi-Ming ; Tseng, Yang-Che ; Hsu, Ya-Ching... - p. 9400-9406 , 2023
Link: https://doi.org/10.1109/..
 
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3

Based on DICOM RT Structure and Multiple Loss Function Deep..:

, In: IFMBE Proceedings; Future Trends in Biomedical and Health Informatics and Cybersecurity in Medical Devices,
Hsieh, Ya-Ju ; Tseng, Hsien-Chun ; Chin, Chiun-Li.. - p. 428-435 , 2019
Link: https://doi.org/10.1007/..
 
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4

Integrating Service QFD and TRIZ for a Lucky Draw System De..:

, In: 2017 IEEE 7th International Symposium on Cloud and Service Computing (SC2),
Tseng, Fang-Mei ; Weng, Ju-yin ; Wu, Nien-Chu... - p. 189-193 , 2017
Link: https://doi.org/10.1109/..
 
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5

A Feasibility Study of Designing a Family-Caregiver-Centred..:

, In: Universal Access in Human-Computer Interaction. Multimodality and Assistive Environments; Lecture Notes in Computer Science,
Chang, Ting-Ya ; Tseng, Kevin C. - p. 431-444 , 2019
Link: https://doi.org/10.1007/..
 
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6

Assessment of Landslide Potential for a Large-Area Forested..:

, In: Lecture Notes in Civil Engineering; Natural Geo-Disasters and Resiliency,
Fan, Chia-Cheng ; Tseng, Wan-Ting ; Yang, Kai-Min. - p. 61-69 , 2024
Link: https://doi.org/10.1007/..
 
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7

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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8

Development of Aero AI for Initial Flight Shape Design of S..:

, In: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Ye, Yu-Lin ; Tseng, Shih-Ting ; Huang, Ching-Huei. - p. 13-18 , 2024
Link: https://doi.org/10.1109/..
 
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9

A Deep Learning based Sustainable Energy Scheduling System:

, In: 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Tsai, Kun-Lin ; Chen, Yan-Hao ; Huang, Choa-Ting.. - p. 401-407 , 2023
Link: https://doi.org/10.1109/..
 
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10

Demonstration of a CMOS-Compatible Superconducting Cryogeni..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chui, King-Jien ; Li, Hongyu ; Ng, Yong Chyn... - p. 617-622 , 2023
Link: https://doi.org/10.1109/..
 
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11

Intrusion Detection with Radio Frequency Sensing based on W..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Wu, Ming-Yen ; Wu, Sz-Hsien ; Chang, Yu-En... - p. 329-330 , 2023
Link: https://doi.org/10.1109/..
 
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12

The 3rd International Workshop on Deep Learning for the Web..:

, In: Companion Proceedings of the ACM Web Conference 2023,
Shi, Cheng ; Chang, Chin-Chen ; Al-Masri, Eyhab... - p. 1257 ff. , 2023
Link: https://dl.acm.org/doi/1..
 
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13

Demonstration and Challenges of Through Si Interposer (TSI)..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Tseng, Ya-Ching ; Chui, King-Jien - p. 1067-1070 , 2023
Link: https://doi.org/10.1109/..
 
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14

Low-temperature solder for low-carbon emitting process:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Wang, Yi-Wun ; Liang, Hua-Tui ; Tseng, Tzu-Ting. - p. 231-234 , 2023
Link: https://doi.org/10.1109/..
 
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15

A Flip-Chip W-band On-off Keying Receiver in 90-nm CMOS:

, In: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023,
Chen, Hong-Shen ; Wu, Hong-Wei ; Tseng, Yun-Ting. - p. 56-59 , 2023
Link: https://doi.org/10.1109/..
 
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