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Uedono, Akira
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1

Exploring Bonding Mechanism of SiCN for Hybrid Bonding:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ebiko, Sodai ; Iacovo, Serena ; Chew, Soon-Aik... - p. 1953-1957 , 2024
Link: https://doi.org/10.1109/..
 
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2

D2W Hybrid Bonding System Achieving High-Accuracy and High-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Mihara, Kentaro ; Hare, Takashi ; Sakai, Hirofumi... - p. 420-426 , 2024
Link: https://doi.org/10.1109/..
 
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3

Inorganic Temporary Direct Bonding for Collective Die to Wa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Inoue, Fumihiro ; Teranishi, Shunsuke ; Iwata, Tomoya... - p. 556-563 , 2023
Link: https://doi.org/10.1109/..
 
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4

Systematic Search for Stabilizing Dopants in ZrO2 and HfO2 ..:

, In: 2022 International Symposium on Semiconductor Manufacturing (ISSM),
Harashima, Yosuke ; Koga, Hiroaki ; Ni, Zeyuan... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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5

Advanced BEOL Materials, Processes, and Integration to Redu..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Nogami, Takeshi ; Gluschenkov, Oleg ; Sulehria, Yasir... - p. 423-424 , 2022
Link: https://doi.org/10.1109/..
 
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6

Impact of Cation Vacancies on Leakage Current on TiN/ZrO2/T..:

, In: 2022 International Symposium on Semiconductor Manufacturing (ISSM),
Uedono, Akira ; Takahashi, Naomichi ; Hasunuma, Ryu... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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7

Vacancy-type defects in GaN-based power device structure - ..:

, In: 2019 Compound Semiconductor Week (CSW),
Uedono, Akira ; Egger, Werner ; Hugenschmidt, Christoph. - p. 1-1 , 2019
Link: https://doi.org/10.1109/..
 
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8

Photoluminescence Studies of Sequentially Mg and H Ion-impl..:

, In: 2019 19th International Workshop on Junction Technology (IWJT),
Shima, Kohei ; Kojima, Kazunobu ; Uedono, Akira. - p. 1-4 , 2019
Link: https://doi.org/10.23919..
 
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