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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Design of Single Miniaturized Dielectric Resonant Antenna f..:
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Lecture Notes in Computer Science; Distributed, Collaborative, and Federated Learning, and Affordable AI and Healthcare for Resource Diverse Global Health ,
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Joint Multi Organ and Tumor Segmentation from Partial Label..:
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Lecture Notes in Computer Science; Clinical Image-Based Procedures, Distributed and Collaborative Learning, Artificial Intelligence for Combating COVID-19 and Secure and Privacy-Preserving Machine Learning ,
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Multi-task Federated Learning for Heterogeneous Pancreas Se..:
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Domain Adaptation and Representation Transfer, and Distributed and Collaborative Learning; Lecture Notes in Computer Science ,
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Automated Pancreas Segmentation Using Multi-institutional C..:
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2020 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW) ,
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NTIRE 2020 Challenge on NonHomogeneous Dehazing:
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2019 Compound Semiconductor Week (CSW) ,
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Sputtering Ambient Effects on Functionality of Al-doped Gal..:
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Sustainability in Energy and Buildings; Smart Innovation, Systems and Technologies ,
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Solar Home System with Peak-Shaving Function and Smart Cont..:
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Lecture Notes in Civil Engineering; Proceedings of the 2nd International Civil Engineering and Architecture Conference ,
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Finite Element Analysis of Lateral Bearing Capacity for Pil..:
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2022 21st IEEE International Conference on Machine Learning and Applications (ICMLA) ,
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Behavior Sequence Transformer Applied on SERP Evaluation an..:
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2019 International Conference on Intelligent Computing, Automation and Systems (ICICAS) ,
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The Application of Image Recognition Technology in Testing ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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High Speed Signal Design on Fan-Out RDL Interposer for Arti..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Investigation of Blind MicroVias Bonding Force: A Field Stu..:
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Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence ,
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