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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Novel Ga Assisted Low-temperature Bonding Technology for Fi..:
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2022 International Electron Devices Meeting (IEDM) ,
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Integration Design and Process of 3-D Heterogeneous 6T SRAM..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
3
First Demonstration of Heterogeneous IGZO/Si CFET Monolithi..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
4
Determination of Biaxial Bending Strength of Thin Silicon D..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S ..:
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2019 IEEE International Conference on Systems, Man and Cybernetics (SMC) ,
6
Estimating Cognitive Processes Related to Haptic Interactio..:
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2019 IEEE Symposium on Computers and Communications (ISCC) ,
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Improving the Localization Accuracy for Sigfox Low-Power Wi..:
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2018 IEEE CPMT Symposium Japan (ICSJ) ,
8
Substrate Shrinkage Effect on Warpage Evaluation for High B..:
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