Wang, Kai-yun
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1

AILC for 2-D systems with unknown control directions and it..:

, In: 2024 IEEE 13th Data Driven Control and Learning Systems Conference (DDCLS),
Xu, Qing-Yuan ; Wang, Bo-Xian ; Fang, Yuan.. - p. 1345-1349 , 2024
 
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2

DanceOnStage: positioning training of dancing stage perform..:

, In: 2024 IEEE International Conference on Artificial Intelligence and eXtended and Virtual Reality (AIxVR),
Wu, Ssu-Hsuan ; Wang, Kai-Ting ; Chiang, Chia-Chen... - p. 270-274 , 2024
 
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3

A SOC Design of ORICA-based Highly Effective Real-time Mult..:

, In: 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC),
Ho, Yun-Lung ; Huang, Yu-De ; Wang, Kai-Yen. - p. 4762-4765 , 2019
 
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4

An Edge AI System-on-Chip Design with Customized Convolutio..:

, In: 2019 IEEE Biomedical Circuits and Systems Conference (BioCAS),
Huang, Yu-De ; Wang, Kai-Yen ; Ho, Yun-Lung.. - p. 1-4 , 2019
 
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6

A Fast and Robust Global Router with Capacity Reduction Tec..:

, In: 2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC),
Fang, Yun-Kai ; Lin, Ye-Chih ; Wang, Ting-Chi - p. 969-974 , 2024
 
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7

A Macro Legalization Approach Considering Minimum Channel S..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2023,
Chiu, Chun-Wei ; Fang, Yun-Kai ; Chung, Shao-Ting. - p. 391-395 , 2023
 
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8

Analysis of Mutual Coupling Effect for 16 Elements Microstr..:

, In: 2023 6th International Conference on Electronics Technology (ICET),
Wang, Kai ; Yan, Hao ; Ma, Jun... - p. 245-249 , 2023
 
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9

A combined simulation and experimental study on cracking an..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Bin ; Lyu, Guang-Chao ; Wang, Hong-Guang... - p. 2046-2053 , 2023
 
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10

A visual question answering method based on question intent..:

, In: 2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP),
Wang, Kai ; Pan, Yun ; Yao, Xiang - p. 1691-1694 , 2023
 
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11

Moisture Desorption and Hygro-Vapor-Thermal Induced Interfa..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Long ; Deng, Yun-Kai ; Wang, Hong-Guang... - p. 1-5 , 2022
 
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12

A Comprehensive Study of Crack Initiation and Delamination ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wang, Hong-Guang ; Lyu, Guang-Chao ; Deng, Yun-Kai... - p. 1459-1464 , 2022
 
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13

Handwritten Chemical Equations Recognition Based on Lightwe..:

, In: Intelligent Computing Theories and Application; Lecture Notes in Computer Science,
Wang, Xiao-Feng ; He, Zhi-Huang ; Wu, Zhi-Ze... - p. 317-329 , 2022
 
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14

WEmap: Weakness-Enhancement Mapping for 3D Reconstruction w..:

, In: Advances in Computer Graphics; Lecture Notes in Computer Science,
Zhang, Kun ; Song, Chunying ; Wang, Jingzhao.. - p. 183-195 , 2022
 
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15

Large-area Die Attachment and the Surface Finish Effect on ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Chun-Meng ; Hou, Bin ; Deng, Yun-Kai.. - p. 1-6 , 2022
 
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