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Wu, Yicai
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Study on Reflow Warpage Deformation of High Pin Density BGA..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xu, Haoyang ; Lyu, Xianliang ; Wang, Yicai... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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The Sixth Visual Object Tracking VOT2018 Challenge Results:

, In: Lecture Notes in Computer Science; Computer Vision – ECCV 2018 Workshops,
Kristan, Matej ; Leonardis, Aleš ; Matas, Jiří... - p. 3-53 , 2019
Link: https://doi.org/10.1007/..
 
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