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Wunderle, K.
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1

Investigation of Aluminum and Gold Flip-Chip Bonding for Qu..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Cirulis, I. ; Zschenderlein, U. ; Braun, S.... - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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2

Thermo — Mechanical characterization and reliability modell..:

, In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
Heilmann, J. ; Nikitin, I. ; May, D... - p. 1-13 , 2015
Link: https://doi.org/10.1109/..
 
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3

Identifying the Reliability Affecting Parameters of SBB Fli..:

, In: 2006 1st Electronic Systemintegration Technology Conference,
Dressler, M. ; Rohde, H. ; Liebing, G.... - p. None , 2006
Link: https://doi.org/10.1109/..
 
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4

Therapie tiefer Beinvenenthrombosen mit dem niedermolekular..:

, In: Deutsche Gesellschaft für Chirurgie; Chirurgisches Forum 2000 für experimentelle und klinische Forschung,
Hach-Wunderle, V. ; Breddin, H. K. ; Kakkar, V. V.. - p. 355-356 , 2000
Link: https://doi.org/10.1007/..
 
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