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Xianjia Huang
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1

Numerical Investigation of Aircraft Impacting Nuclear Power..:

, In: 2019 9th International Conference on Fire Science and Fire Protection Engineering (ICFSFPE),
Li, Zhibiao ; Zhuo, Xunjia ; Huang, Tao... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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2

The Bilevel Programming Model of Earthwork Allocation Syste:

, In: Communications in Computer and Information Science; Cutting-Edge Research Topics on Multiple Criteria Decision Making,
Xianjia, Wang ; Yuan, Huang ; Wuyue, Zhang - p. 275-281 , 2009
Link: https://doi.org/10.1007/..
 
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3

Stress-strain analysis and optimization of laminated solder..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Liye ; Huang, Chunyue ; Liu, Xiaobin... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

Analysis of torsional stresses in POP solder joints under c..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Jiahua ; Huang, Chunyue ; Yin, Shupei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Study of TSV Interconnection Structure Based on Coupled Hig..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Bin ; Huang, Chunyue ; Gao, Chao... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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6

Stress-strain analysis and optimization of TSV interconnect..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Lilin ; Huang, Chunyue ; Wu, Liye... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

Thermal stress analysis and optimization of BGA stacked sol..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xianjia ; Huang, Chunyue ; Wang, Lilin... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

Stress analysis and geometrical parameter optimization of L..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lan, Jingyi ; Huang, Chunyue ; Yin, Shupei.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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9

Optimization of stress and related parameters of BGA solder..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Junjian ; Huang, Chunyue ; Li, Shuyi... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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10

Stress Analysis and Optimization of BGA Solder Joints Under..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xiaobin ; Huang, Chunyue ; Wu, Liye... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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11

QFP solder joint bending stress analysis and parameter opti..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Xianjia ; Huang, Chunyue ; Wang, Lilin... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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12

Stress analysis and optimization of microscale CSP solder j..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Lilin ; Huang, Chunyue ; Liu, Xianjia... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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13

Stress-Strain Analysis and Parameter Optimization of Sop So..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wu, Liye ; Huang, Chunyue ; Liu, Xiaobin... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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