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Yamashita, T.
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1

Development of a GAGG prompt gamma camera and simultaneous ..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Yamamoto, S. ; Yamashita, T. ; Kobashi, Y.... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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2

Design of a Database-Driven Quality Predictor for Painting ..:

, In: 2022 IEEE International Symposium on Advanced Control of Industrial Processes (AdCONIP),
Yamamoto, S. ; Kinoshita, T. ; Wakitani, S.... - p. 194-197 , 2022
Link: https://doi.org/10.1109/..
 
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3

Subtractive Ru Interconnect Enabled by Novel Patterning Sol..:

, In: 2022 International Electron Devices Meeting (IEDM),
Penny, C. ; Motoyama, K. ; Ghosh, S.... - p. 12.1.1-12.1.4 , 2022
Link: https://doi.org/10.1109/..
 
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4

Pixel Pitch Hybrid Bonding and Three Layer Stacking Technol..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Tanida, K. ; Suzuki, S. ; Seo, T.... - p. 5-7 , 2022
Link: https://doi.org/10.1109/..
 
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5

Effects of Exercise-Diet Therapy on Cognitive Function in H..:

, In: Advances in Experimental Medicine and Biology; Oxygen Transport to Tissue XLIII,
Sakatani, K. ; Oyama, K. ; Hu, L... - p. 139-143 , 2022
Link: https://doi.org/10.1007/..
 
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6

Mushroom-Type phase change memory with projection liner: An..:

, In: 2021 IEEE International Reliability Physics Symposium (IRPS),
Bruce, R.L. ; Sarwat, S. Ghazi ; Boybat, I.... - p. 1-6 , 2021
Link: https://doi.org/10.1109/..
 
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7

Vertical-Transport Nanosheet Technology for CMOS Scaling be..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Jagannathan, H. ; Anderson, B. ; Sohn, C-W.... - p. 26.1.1-26.1.4 , 2021
Link: https://doi.org/10.1109/..
 
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8

Impact of Anode-side Defect Generation on Inter-Level TDDB ..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Suzumura, N. ; Omori, K. ; Tsuchiya, H... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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9

Multi-trench-gate Cell Concept for Low Voltage Superjunctio..:

, In: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Eikyu, K. ; Sakai, A. ; Yamashita, T.... - p. 553-556 , 2020
Link: https://doi.org/10.1109/..
 
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10

Sub-6V Operation of Split-Gate Type Charge-Trapping Nonvola..:

, In: 2020 IEEE International Memory Workshop (IMW),
Wang, Y. Z. ; Amo, A. ; Maekawa, K.... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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11

Impact of Homogeneously Dispersed Al Nanoclusters by Si-mon..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Maekawa, K. ; Yamashita, T. ; Yamaguchi, T.... - p. 15.4.1-15.4.4 , 2019
Link: https://doi.org/10.1109/..
 
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12

Imaging, Modeling and Engineering of Strain in Gate-All-Aro..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Reboh, S. ; Boureau, V. ; Yamashita, T.... - p. 11.5.1-11.5.4 , 2019
Link: https://doi.org/10.1109/..
 
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13

Full Bottom Dielectric Isolation to Enable Stacked Nanoshee..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Zhang, J. ; Frougier, J. ; Greene, A.... - p. 11.6.1-11.6.4 , 2019
Link: https://doi.org/10.1109/..
 
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14

Shock Wave Generation Method Using High-Speed Jet:

, In: 31st International Symposium on Shock Waves 1,
Iwakawa, A. ; Kawasaki, H. ; Kayumi, M.... - p. 849-853 , 2019
Link: https://doi.org/10.1007/..
 
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15

Co-Existence of 87 Mbit/s Quantum and 10 Gbit/s Classical C..:

, In: 2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC),
Da Lio, B. ; Terai, H. ; Yamashita, T.... - p. 1-1 , 2019
Link: https://doi.org/10.1109/..
 
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