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2023 International Conference on Electronics Packaging (ICEP) ,
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How to enhance Sn-Bi low-temperature solder by alloying?:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Sn-based solder design using machine learning approach:
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2022 International Conference on Electronics Packaging (ICEP) ,
3
Mechanical properties of Sn-Bi-Ag low-temperature Pb-free s..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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High thermal stability Cu-to-Cu joints fabricated by using ..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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Effect of low Bi content on mechanical properties of Sn-Bi-..:
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Proceedings of the International Conference on Research in Adaptive and Convergent Systems ,
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Accelerating Variant Calling with Parallelized DeepVariant:
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Composite Technologies for 2020 ,
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Static and Fatigue Analysis of Double-Bolted-Joints for Gr/..:
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2023 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 22nm 832Kb Hybrid-Domain Floating-Point SRAM In-Memory-Co..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
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Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge Fin..:
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2021 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) ,
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Invisible Lighting System for Remote Surveillance:
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2020 IEEE Symposium on VLSI Technology ,
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Ultrahigh responsivity and tunable photogain BEOL compatibl..:
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2019 Compound Semiconductor Week (CSW) ,
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High Performance Normally-Off AlGaN/GaN MIS-HEMT Using Char..:
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2019 Twelfth International Conference on Ubi-Media Computing (Ubi-Media) ,
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A Medical PBL System for Clinical Diagnosis Training in Med..:
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CHI '14 Extended Abstracts on Human Factors in Computing Systems ,
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Gaussbricks : magnetic building blocks for constructive ..:
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CHI '14 Extended Abstracts on Human Factors in Computing Systems ,
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