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Yang, Jiyeon
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1

High Performance Multi-Chip Leadframe Package with Internal..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Park, DaeYoung ; Jeon, HyeongIl ; Kim, GiJeong... - p. 160-164 , 2022
Link: https://doi.org/10.1109/..
 
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2

Thermal Cycle Reliability of BGA Package With Board-Level U..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Park, Jiyeon ; Kim, Dajung ; Yang, Hyunseung.. - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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3

Understanding the Use of AI-Based Audio Generation Models b..:

, In: Extended Abstracts of the 2024 CHI Conference on Human Factors in Computing Systems,
Han, Jiyeon ; Yang, Eunseo ; Oh, Uran - p. 1-7 , 2024
Link: https://dl.acm.org/doi/1..
 
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