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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
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Finite Element Analysis of Casing Premium Thread Under Alte..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2019 ,
2
Completion String Seal Design Method with Cyclic Alternatin..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2019 ,
3
Casing Bearing Capacity with Shear Load for Shale Gas Wells:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2019 ,
4
Experimental and Theoretical Analysis of Casing Collapse St..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
5
Two-stage Adaptive Compressive Sensing and Reconstruction f..:
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2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) ,
6
Masked Stereolithography 3D-printed Terahertz Diffractive L..:
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2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) ,
7
High power polarization-insensitive InGaAs-based Photomixer..:
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2022 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) ,
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PatchNet: A Simple Face Anti-Spoofing Framework via Fine-Gr..:
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Lecture Notes in Computer Science; Computer Vision – ECCV 2022 ,
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Seeing Through a Black Box: Toward High-Quality Terahertz I..:
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2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) ,
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Polarization-insensitive InGaAs-based THz plasmonic photomi..:
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Handbook of Materials Failure Analysis with Case Studies from the Aerospace and Automotive Industries ,
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Contributors:
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Proceedings of the 2014 ACM SIGSAC Conference on Computer and Communications Security ,
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Verifying Curve25519 Software:
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Proceedings of the 2006 Asia and South Pacific Design Automation Conference ,
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Algorithms and DSP implementation of H.264/AVC:
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Proceedings of the 17th ACM Great Lakes symposium on VLSI ,
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