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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Vertical Fan Out(VFO) package with enhanced form factor and..:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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A noble VFO(Vertical wire Fan Out) technology for small for..:
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Proceedings of the 5th International Conference on Ubiquitous Information Management and Communication ,
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Enhancing hand gesture recognition using fuzzy clustering-b..:
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23rd International Symposium on High Voltage Engineering (ISH 2023) ,
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An evaluation of condition monitoring and diagnosis system ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Micro-structure analysis of solder joint using room tempera..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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13.2 A 32Gb 8.0Gb/s/pin DDR5 SDRAM with a Symmetric-Mosaic ..:
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Proceedings of the 29th ACM SIGKDD Conference on Knowledge Discovery and Data Mining ,
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Ball Trajectory Inference from Multi-Agent Sports Contexts ..:
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2022 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
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A Digital Temperature Sensor Based on 10b SAR ADC for Non-l..:
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Proceedings of the 2020 5th International Conference on Intelligent Information Technology ,
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Seismic Data Analysis Regression Model on Reactor Pressure ..:
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2022 23rd International Vacuum Electronics Conference (IVEC) ,
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A Ceramic Surface Charging Model for Accurate Prediction of..:
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2017 30th International Vacuum Nanoelectronics Conference (IVNC) ,
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Field emission properties of triode structure CNT film emit..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Fan-out Wafer Level Package for Memory Applications:
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Lecture Notes in Electrical Engineering; Proceedings of the Sixth International Conference on Green and Human Information Technology ,
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