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Yu, Geum Bong
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1

Thermal Management in Multi-Finger GaN-on-Si HEMTs: Underst..:

, In: 2023 International Electron Devices Meeting (IEDM),
Jeong, Jaeyong ; Choi, Sung Joon ; Shim, Joonsup... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Fully CMOS-Compatible Room-Temperature Waveguide-Integrated..:

, In: 2023 International Electron Devices Meeting (IEDM),
Shim, Joonsup ; Lim, Jinha ; Kim, Inki... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

IL Scavenging and Recovery Strategies to Improve the Perfor..:

, In: 2023 International Electron Devices Meeting (IEDM),
Kim, Bong Ho ; Kim, Seong Kwang ; Kuk, Song-hyeon... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

Role of Inter-Layer Dielectric on the Electrical and Heat D..:

, In: 2023 International Electron Devices Meeting (IEDM),
Kim, Seong Kwang ; Lim, Hyeong-Rak ; Shim, Joonsup... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

3D Stackable Cryogenic InGaAs HEMT-Based DC and RF Multiple..:

, In: 2022 International Electron Devices Meeting (IEDM),
Jeong, Jaeyong ; Kim, Seong Kwang ; Kim, Jongmin... - p. 4.5.1-4.5.4 , 2022
Link: https://doi.org/10.1109/..
 
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6

A sub-micron-thick InGaAs broadband (400-1700 nm) photodete..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Geum, Dae-Myeong ; Lim, Jinha ; Jang, Junho... - p. 413-414 , 2022
Link: https://doi.org/10.1109/..
 
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7

Heterogeneous 3D Sequential CFET with Ge (110) Nanosheet p-..:

, In: 2022 International Electron Devices Meeting (IEDM),
Kim, Seong Kwang ; Lim, Hyeong-Rak ; Jeong, Jaejoong... - p. 20.1.1-20.1.4 , 2022
Link: https://doi.org/10.1109/..
 
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8

3D Stackable Broadband Photoresponsive InGaAs Biristor Neur..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Han, Joon-Kyu ; Sim, Jaeho ; Geum, Dae-Myeong... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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