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Yu, Jiexun
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1

Low Temperature Cu/SiO2 Hybrid Bonding with Protruding Copp..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Fang, Jun-Peng ; Wang, Qian ; Yu, Jie-Xun... - p. 1911-1915 , 2024
Link: https://doi.org/10.1109/..
 
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2

Through-silicon-via Architecture of 3D Integration for Supe..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yu, Jiexun ; Wang, Qian ; Zheng, Yao... - p. 1844-1851 , 2023
Link: https://doi.org/10.1109/..
 
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3

Finite element and phase field simulation methods for homog..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Xiong, Zishan ; Zhao, Xiuchen ; Yu, Jiexun... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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4

Indium-based Flip-chip Interconnection for Superconducting ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Yu, Jiexun ; Zheng, Yao ; Zhou, Shengjuan... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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5

A Deep Learning Based Pipeline for Image Grading of Diabeti..:

, In: Smart Health; Lecture Notes in Computer Science,
Wang, Yu ; Wang, G. Alan ; Fan, Weiguo. - p. 240-248 , 2018
Link: https://doi.org/10.1007/..
 
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