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Zaal, Kristien J.M.
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1

Reduction of empiricism in the solder joint reliability ass..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Soestbergen, M. van ; Roucou, R. ; Rebosolan, M.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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2

Predictive thermo-mechanical models for the quantification ..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Zaal, J.J.M. ; He, C. ; Claes, J.A.M.... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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3

Considerations on a Smart Strategy for Simultaneously Testi..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Thukral, V. ; Roucou, R. ; Sauze, S.... - p. 793-800 , 2020
Link: https://doi.org/10.1109/..
 
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4

Effect of Environmental and Testing Conditions on Board Lev..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Roucou, R. ; Zaal, J. J. M. ; Jalink, J... - p. 1105-1111 , 2016
Link: https://doi.org/10.1109/..
 
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5

Crevice Corrosion of Ball Bond Intermetallics of Cu and Ag ..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Van Soestbergen, M. ; Mavinkurve, A. ; Zaal, J.J.M.... - p. 774-781 , 2016
Link: https://doi.org/10.1109/..
 
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6

Characterization of a Piezoresistive Sensor for In-Situ Hea..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Inamdar, Adwait ; Thukral, Varun ; Zhang, Letian... - p. 157-163 , 2024
Link: https://doi.org/10.1109/..
 
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7

Neurobiology of Postischemic Recuperation in the Aged Mamma..:

, In: Neurovascular Medicine,
Popa-Wagner, Aurel ; Balseanu, Adrian ; Zagrean, Leon... - p. 403-451 , 2009
Link: https://doi.org/10.1093/..
 
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