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Zeng, Xiangliang
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1

Experimental validation of a simple fractional model for vi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Fan, Jianfeng ; Wu, Weijian ; Zeng, Xiangliang... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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2

Effect of Filler Particle Size and Surface Functionalizatio..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zeng, Xiangliang ; Fan, Jianfeng ; Rao, Shipeng... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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3

High energy dissipation composite elastomer for application..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wu, Weijian ; Wang, Hangqian ; Zeng, Xiangliang... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

Optimizing Thermal Properties of Thermal Interface Material..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Ding, Shengchang ; He, Dongyi ; Cai, Linfeng... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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5

The Study of Effects to the Thermo-Mechanical Performance o..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Zhenyu ; Ren, Linlin ; Zeng, Xiangliang... - p. 1-6 , 2021
Link: https://doi.org/10.1109/..
 
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6

Study on the Influence of Different Filler Fractions on the..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Ye, Wenbo ; Wang, Zhenyu ; Zeng, Xiangliang... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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7

A Low-Temperature-Coefficient and High-PSRR Bandgap Referen..:

, In: 2019 IEEE 13th International Conference on ASIC (ASICON),
Ye, Xuefeng ; Zeng, Duoduo ; Jin, Xiangliang. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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8

Comparative Study of Total Ionizing Dose Effects on the Sil..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Chen, Zhuojun ; Lu, Wenzhao ; Wu, Ming... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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9

DMIL-III: Isoform-isoform interaction prediction using deep..:

, In: 2019 IEEE International Conference on Bioinformatics and Biomedicine (BIBM),
Zeng, Jie ; Yu, Guoxian ; Wang, Jun.. - p. 171-176 , 2019
Link: https://doi.org/10.1109/..
 
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10

A Comprehensive Study of a Bidirectional ESD Protection Dev..:

, In: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo),
Chen, Zhuojun ; Wu, Zhiqiang ; Wu, Ming... - p. 111-113 , 2019
Link: https://doi.org/10.1109/..
 
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