Zhang, Guang-Ping
817  results:
Search for persons X
?
1

Towards Rectifying Performance at the Molecular Scale:

, In: Molecular-Scale Electronics; Topics in Current Chemistry Collections,
Zhang, Guang-Ping ; Xie, Zhen ; Song, Yang.. - p. 137-172 , 2017
 
?
3

H5N1 Avian Influenza in Human:

, In: Avian Influenza in Human,
Zhang, Qian-qian ; Xu, He-ping ; Sun, Yong... - p. 103-113 , 2021
 
?
4

The Centrality Analysis of the Fuzzy Technology Innovation ..:

, In: Advances in Intelligent Systems and Computing; Fuzzy Sets and Operations Research,
Liao, Li-ping ; Zhang, Guang-yu - p. 149-165 , 2019
 
?
5

Fuzzy-Neural Theory Applied to Web-Based Proactive Service:

, In: Proceedings of the 2005 IEEE/WIC/ACM International Conference on Web Intelligence,
Li, Yuan-chao ; Wu, Xiao-dong ; Zhang, De-gan. - p. 116-119 , 2005
 
?
6

A Study on Penetration Technology of Breaking the Wall by D..:

, In: 2023 International Seminar on Computer Science and Engineering Technology (SCSET),
 
?
7

Nonlinear Multi-system Interactive Positioning Algorithms:

, In: Lecture Notes in Electrical Engineering; Communications, Signal Processing, and Systems,
Ma, Xin-xin ; Deng, Ping-ke ; Zhang, Xiao-guang - p. 355-365 , 2020
 
?
8

Biomarkers in Immunology : from Concepts to Applications:

, In: Proceedings of the International Conference on Bioinformatics, Computational Biology and Biomedical Informatics,
Zhang, Ping ; Chitkushev, Lou ; Brusic, Vladimir. - p. 826-835 , 2013
 
?
9

Rock Mechanics and Wellbore Stability Analysis in Chinook R..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022,
Yan, Ping ; Chang, Jin-yu ; Zhang, Yong-feng... - p. 24-34 , 2023
 
?
10

An Extensive Study of the Effects of Packaging Structure an..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lyu, Guang-Chao ; Chen, Bin ; Zhang, Xin-Ping... - p. 647-654 , 2023
 
?
11

A combined simulation and experimental study on cracking an..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Bin ; Lyu, Guang-Chao ; Wang, Hong-Guang... - p. 2046-2053 , 2023
 
?
12

Finite Element Simulation Study of the Effects of Kirkendal..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
 
?
13

Interfacial Delamination Characterization and Thermo-mechan..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Chen, Bin ; Wang, Hong-Guang ; Lyu, Guang-Chao... - p. 1-5 , 2022
 
?
14

A Comprehensive Study of Crack Initiation and Delamination ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wang, Hong-Guang ; Lyu, Guang-Chao ; Deng, Yun-Kai... - p. 1459-1464 , 2022
 
?
15

An extensive simulation study of the interfacial delaminati..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lyu, Guang-Chao ; Wang, Hong-Guang ; Zhou, Min-Bo. - p. 1614-1623 , 2022
 
1-15