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2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) ,
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Multi-spectral terahertz interferometric imaging based on a..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Ultra-Sensitive Visualization and Identification of Defects..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Rapid and specific failure analysis by fluorescence-guided ..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
4
Enhanced failure and contamination analysis of challenging ..:
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2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
5
Novel Submicron Spatial Resolution Infrared Microspectrosco..:
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360° Around Shoulder Instability ,
10
Arthroscopic Distal Tibial Allograft Reconstruction Using D..:
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Proceedings of the Designing Interactive Systems Conference ,
13
MelodicBrush : a novel system for cross-modal digital ar..:
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CHI '12 Extended Abstracts on Human Factors in Computing Systems ,
14