Search for persons
X
?
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
2
Effects of two-step plasma treatment on Cu and SiO2 surface..:
, In:
?
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
3
Development of CMOS-Compatible Low Temperature Cu Bonding O..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
6
Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
7
Fly Cutting for Polymer Planarization in Hybrid Cu Bonding:
, In:
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
Thermal Transport Properties of Hybrid Bonding With Passiva..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
9
Effect of Evaporated and Sputtered Au Nanolayers on Cu Surf..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
12