Search for persons
X
?
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
1
Ultra High Density Package Design and Electrical Analysis i..:
, In:
?
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ,
2
The Comparison of Package Design and Electrical Analysis in..:
, In:
?
2019 IEEE CPMT Symposium Japan (ICSJ) ,
3
High Density IO Fan-out Design Optimization with Signal Int..:
, In:
?
ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
11
On the Importance of Neural Wiener Filter for Resource Effi..:
, In:
?
ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
12