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2024 International Conference on Electronics Packaging (ICEP) ,
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Mold Flow Strategy Improvement for Power Module:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Innovative Two-Phase Immersion Cooling Solutions for high-p..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Creative Design and Structure Applied to Chiplets Packaging:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Improved Compact Thermal Model for Over-Molded Packages:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Mechanical and Thermal Characterization Analysis of Chip-la..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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