Search for persons
X
?
2024 International Conference on Electronics Packaging (ICEP) ,
1
High Speed D2D Interface Applied on Advanced Package:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
2
Electrical Performance Analysis for Bridge Die Package Solu..:
, In:
?
2019 IEEE CPMT Symposium Japan (ICSJ) ,
3
High Density IO Fan-out Design Optimization with Signal Int..:
, In:
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:
, In:
?
2023 International Conference on Electronics Packaging (ICEP) ,
9
Semiconductor Package Design Flow and Platform Applied on F..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
10
A Low-Cost Antenna-in-Package (AiP) for D-Band Application:
, In:
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
11
Mitigate Package Level Crosstalk Using Tabbed Design:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
12
Creative Design and Structure Applied to Chiplets Packaging:
, In:
?
2023 IEEE CPMT Symposium Japan (ICSJ) ,
13
Crosstalk Mitigation for High Speed SerDes Applications on ..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
15