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Zhi, Ding
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1

Stoichiometric ratios in soil are relevant to the abundance..:

Ying, Liu ; Maohua, Ma ; Zhi, Ding...
CATENA.  234 (2024)  - p. 107548 , 2024
Link: https://doi.org/10.1016/..
 
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2

Plant–plant interactions vary greatly along a flooding grad..:

Ying, Liu ; Yanfeng, Wang ; Wenzhou, Wu...
Frontiers in Plant Science.  14 (2023)  - p. , 2023
Link: https://doi.org/10.3389/..
 
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3

Light–acquisition traits link aboveground biomass and envir..:

Ying, Liu ; Maohua, Ma ; Zhi, Ding...
Science of The Total Environment.  857 (2023)  - p. 159660 , 2023
Link: https://doi.org/10.1016/..
 
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4

Stress–dilatancy behavior of dense marine calcareous sand u..:

He, Shao-Heng ; Zhi, Ding ; Sun, Yifei..
Ocean Engineering.  244 (2022)  - p. 110437 , 2022
Link: https://doi.org/10.1016/..
 
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5

Deep learning based RF fingerprinting for device identifica..:

Wu, Qingyang ; Feres, Carlos ; Kuzmenko, Daniel...
Electronics Letters.  54 (2018)  24 - p. 1405-1407 , 2018
Link: https://doi.org/10.1049/..
 
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6

On TDD cross-tier in-band interference mitigation: A practi..:

, In: 2012 7th International ICST Conference on Cognitive Radio Oriented Wireless Networks and Communications (CROWNCOM),
Cierny, Michal ; Wichman, Risto ; Hamalainen, Jyri... - p. None , 2012
Link: https://doi.org/10.4108/..
 
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7

Prevalence of Nontuberculous Mycobacteria and the Emergence..:

Hongmei, Shi ; Ruixia, Liang ; Jiankang, Li...
Epidemiology and Infection.  , 2024
Link: https://doi.org/10.1017/..
 
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8

Genomic copy number variation of the CHKB gene alters gene ..:

Goshu, Habtamu Abera ; Chu, Min ; Xiaoyun, Wu...
Molecular Genetics and Genomics.  294 (2019)  3 - p. 549-561 , 2019
Link: https://doi.org/10.1007/..
 
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9

Thermo-mechanical design of fan-out wafer level package for..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Chen, Zhaohui ; Gongyue, Tang ; Long, Lau Boon... - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
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10

Process and Reliability of Large Fan-Out Wafer Level Packag..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Rao, Vempati Srinivasa ; Chong, Chai Tai ; Ho, David... - p. 615-622 , 2017
Link: https://doi.org/10.1109/..
 
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11

Development of High Density Fan Out Wafer Level Package (HD..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Rao, Vempati Srinivasa ; Chong, Chai Tai ; Ho, David... - p. 1522-1529 , 2016
Link: https://doi.org/10.1109/..
 
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12

N546 in β18–β19 loop is important for binding and toxicity ..:

Xiang, Wang Fa ; Qiu, Xia Li ; Zhi, Ding Xue...
Journal of Invertebrate Pathology.  101 (2009)  2 - p. 119-123 , 2009
Link: https://doi.org/10.1016/..
 
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13

Predictions of failure mode and arresting efficiency of int..:

Wang, Xipeng ; Wang, Chuangyi ; Yuan, Lin..
Engineering Failure Analysis.  159 (2024)  - p. 108096 , 2024
Link: https://doi.org/10.1016/..
 
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14

Body Motion Segmentation via Multilayer Graph Processing fo..:

Deng, Qinwen ; Zhang, Songyang ; Ding, Zhi
IEEE Open Journal of Signal Processing.  , 2024
Link: https://doi.org/10.1109/..
 
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15

Enhanced theoretical approach for predicting the tunnel res..:

Feng, Guohui ; Xu, Changjie ; Ding, Zhi...
Transportation Geotechnics.  48 (2024)  - p. 101309 , 2024
Link: https://doi.org/10.1016/..
 
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