Drechsler, U.
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9

3D opto-electrical device stacking on CMOS:

Dellmann, L. ; Drechsler, U. ; Morf, T....
Microelectronic Engineering.  87 (2010)  5-8 - p. 1210-1212 , 2010
 
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10

A mass-balanced through-wafer electrostatic x/y-scanner for..:

Engelen, J.B.C. ; Rothuizen, H.E. ; Drechsler, U....
Microelectronic Engineering.  86 (2009)  4-6 - p. 1230-1233 , 2009
 
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11

Integrating nanotechnology into a working storage device:

Knoll, A. ; Bächtold, P. ; Bonan, J....
Microelectronic Engineering.  83 (2006)  4-9 - p. 1692-1697 , 2006
 
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14

SU-8 for real three-dimensional subdiffraction-limit two-ph..:

Teh, W. H. ; Dürig, U. ; Salis, G....
Applied Physics Letters.  84 (2004)  20 - p. 4095-4097 , 2004
 
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15

Temperature dependent nano indentation of thin polymer film..:

Hinz, M. ; Kleiner, A. ; Hild, S....
European Polymer Journal.  40 (2004)  5 - p. 957-964 , 2004
 
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