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Gao, Li‐Yin
77
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1
Modulation on the twinning microstructure of Cu nanowires a..:
Chen, Ke-Xin
;
Gao, Li-Yin
;
Meng, Zhi-Chao
.
Chemical Engineering Journal. 496 (2024) - p. 154308 , 2024
Link:
https://doi.org/10.1016/..
?
2
Effect of impurities on anisotropic grain growth in (111)-o..:
Zhang, Minghui
;
Gao, Li-Yin
;
Zhang, Qi
...
Materials Characterization. 214 (2024) - p. 114056 , 2024
Link:
https://doi.org/10.1016/..
?
3
Micro-cones Cu fabricated by pulse electrodeposition for so..:
Zhang, Minghui
;
Gao, Li-Yin
;
Wang, Yu-Xi
...
Applied Surface Science. 650 (2024) - p. 159184 , 2024
Link:
https://doi.org/10.1016/..
?
4
The mechanical property and microstructural thermal stabili..:
Zhang, Yu-Bo
;
Gao, Li-Yin
;
Tao, Jun-Lei
...
Materials Today Communications. 38 (2024) - p. 108182 , 2024
Link:
https://doi.org/10.1016/..
?
5
Significant inhibition of interfacial Cu6Sn5 IMC and improv..:
Lu, Xiao
;
Zhang, Liang
;
Liu, Zhi-Quan
...
Materials Characterization. 208 (2024) - p. 113668 , 2024
Link:
https://doi.org/10.1016/..
?
6
Manipulating adsorbate configurations in copper electroplat..:
Peng, Zhen-Jia
;
Li, Zhe
;
Jiao, Yu
...
Nano Materials Science. , 2024
Link:
https://doi.org/10.1016/..
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7
Improving Electromigration Resistance of Fine‐Pitch Redistr..:
Shi, Zixiang
;
Wang, ZeSong
;
Gao, Li‐Yin
...
Advanced Engineering Materials. 26 (2024) 6 - p. , 2024
Link:
https://doi.org/10.1002/..
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8
Influence of Macroscale Dimension on the Electrocrystalliza..:
Liu, Jin‐Hao
;
Wan, Yong‐Qiang
;
Gao, Li‐Yin
..
Advanced Engineering Materials. 26 (2024) 12 - p. , 2024
Link:
https://doi.org/10.1002/..
?
9
Study on the dual inhibition behavior of interfacial IMCs i..:
Lu, Xiao
;
Zhang, Liang
;
Guo, Yong-huan
...
Journal of Materials Research and Technology. 25 (2023) - p. 3754-3767 , 2023
Link:
https://doi.org/10.1016/..
?
10
Characterization of Cu-Cu direct bonding in ambient atmosph..:
Zhang, Minghui
;
Gao, Li-Yin
;
Li, Jun-Jie
..
Materials Chemistry and Physics. 306 (2023) - p. 128089 , 2023
Link:
https://doi.org/10.1016/..
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11
Synthesis of Cu Nanowires by Template Electrodeposition and..:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
Journal of Electronic Materials. 52 (2023) 5 - p. 3463-3471 , 2023
Link:
https://doi.org/10.1007/..
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12
Extremely Low Contact Resistivity of Bi2Te3-Based Modules E..:
Min, Erbiao
;
Ling, Yifeng
;
Zhao, Linghao
...
ACS Applied Materials & Interfaces. 15 (2023) 50 - p. 59066-59074 , 2023
Link:
https://doi.org/10.1021/..
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13
Research Progress of Electroplated Nanotwinned Copper in Mi..:
Chen, Ke-Xin
;
Gao, Li-Yin
;
Li, Zhe
..
Materials. 16 (2023) 13 - p. 4614 , 2023
Link:
https://doi.org/10.3390/..
?
14
Gradient interface formation in Cu–Cr/diamond(Ti) composite..:
Wang, Luhua
;
Li, Jianwei
;
Gao, Liyin
...
Vacuum. 206 (2022) - p. 111549 , 2022
Link:
https://doi.org/10.1016/..
?
15
The self-healing of Kirkendall voids on the interface betwe..:
Zhou, Shiqi
;
Zhang, Yu-Bo
;
Gao, Li-Yin
..
Applied Surface Science. 588 (2022) - p. 152900 , 2022
Link:
https://doi.org/10.1016/..
1-15