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Jalar, Azman
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1

Ultrasonic Al Bond on Mo Back-Contact Layer of CIGS Solar P..:

Hamid, Sabarina Abdul ; Zulkifli, Muhammad Nubli ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  6 - p. 1123-1133 , 2024
Link: https://doi.org/10.1109/..
 
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2

Laser Rework Process for Efficient Lead-Free Solder Joints ..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 735-742 , 2024
Link: https://doi.org/10.1109/..
 
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3

Titanium dioxide ion-sensitive extended gate field effect t..:

Al-Hardan, Naif H. ; Hamid, Muhammad Azmi Abdul ; Firdaus-Raih, Mohd...
Journal of Materials Science: Materials in Electronics.  35 (2024)  5 - p. , 2024
Link: https://doi.org/10.1007/..
 
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4

Micromechanical and microstructure evolution of leaded (SnP..:

Zulkifli, Muhammad Nubli ; Abdullah, Izhan ; Azhan, Nurul Hanis.
Journal of Adhesion Science and Technology.  , 2024
Link: https://doi.org/10.1080/..
 
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5

Undissolved gold in fine-pitch BGA solder joint under therm..:

Ismail, Adlil Aizat ; Abu Bakar, Maria ; Jalar, Azman...
Journal of Materials Science: Materials in Electronics.  35 (2024)  12 - p. , 2024
Link: https://doi.org/10.1007/..
 
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6

Effect of ultrasonic bonding and lamination on electrical p..:

Basher, Hassan ; Zulkifli, Muhammad Nubli ; Jalar, Azman.
Journal of Adhesion Science and Technology.  38 (2024)  14 - p. 2477-2496 , 2024
Link: https://doi.org/10.1080/..
 
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7

Effect of Nd on microstructure and mechanical properties of..:

Wang, Linghao ; Jalar, Azman ; Dan, Longhong
Journal of Alloys and Compounds.  936 (2023)  - p. 168278 , 2023
Link: https://doi.org/10.1016/..
 
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8

Unleashing the potential of gallium oxide: A paradigm shift..:

Al-Hardan, Naif H. ; Abdul Hamid, Muhammad Azmi ; Jalar, Azman.
Materials Today Physics.  38 (2023)  - p. 101279 , 2023
Link: https://doi.org/10.1016/..
 
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9

Moisture Content and Early Corrosion Detection of Cu Wire B..:

Supramaniam, Saraswathy ; Bakar, Maria Abu ; Atiqah, A...
Journal of Failure Analysis and Prevention.  23 (2023)  6 - p. 2362-2369 , 2023
Link: https://doi.org/10.1007/..
 
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10

Dynamic precipitation and dynamic recrystallization behavio..:

Wang, Linghao ; Jalar, Azman ; Dan, Longhong
Journal of Materials Research and Technology.  26 (2023)  - p. 7634-7648 , 2023
Link: https://doi.org/10.1016/..
 
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11

Effect of Die Deflection during Au Wire Bonding Process on ..:

Azahar, Ahmad Zarif ; Bakar, Maria Abu ; Jalar, Azman.
Journal of Materials Engineering and Performance.  33 (2023)  12 - p. 5836-5845 , 2023
Link: https://doi.org/10.1007/..
 
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12

EDS analysis on effect of low dosage gamma radiation and mi..:

Lehan, Nur Farisa Nadia Mohmad ; Yusoff, Wan Yusmawati Wan ; Sobri, Normidatul Salwa...
Journal of Materials Science: Materials in Electronics.  33 (2022)  7 - p. 4225-4236 , 2022
Link: https://doi.org/10.1007/..
 
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13

Early Corrosion Detection of Cu-Ag Wedge bonding in Semicon..:

Supramaniam, Saraswathy ; Bakar, Maria Abu ; Jalar, Azman
Journal of Failure Analysis and Prevention.  22 (2022)  6 - p. 2317-2325 , 2022
Link: https://doi.org/10.1007/..
 
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14

Magnesium-doped ZnO nanorod electrolyte–insulator–semicondu..:

Al-Khalqi, Ensaf Mohammed. ; Abdul Hamid, Muhammad Azmi ; Al-Hardan, Naif H...
Journal of Materials Science: Materials in Electronics.  33 (2022)  3 - p. 1618-1630 , 2022
Link: https://doi.org/10.1007/..
 
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15

Review on Corrosion in Electronic Packaging Trends of Colla..:

Bakar, Maria Abu ; Atiqah, A. ; Jalar, Azman
Sustainability.  14 (2022)  23 - p. 15730 , 2022
Link: https://doi.org/10.3390/..
 
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