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Liang, Shuibao
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1

Investigating the preferential growth of Bi grains in Sn-Bi..:

Liang, Shuibao ; Jiang, Han ; Zhong, Zhihong..
Journal of Materials Research and Technology.  28 (2024)  - p. 4152-4161 , 2024
Link: https://doi.org/10.1016/..
 
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2

Insights Into the Grain Orientation Effect on Electromigrat..:

Liang, Shuibao ; Jiang, Han ; Zhong, Zhihong.
IEEE Transactions on Electron Devices.  71 (2024)  1 - p. 192-199 , 2024
Link: https://doi.org/10.1109/..
 
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3

Investigation of Effects of Porosity and Coarsening on Ther..:

Jiang, Han ; Liang, Shuibao ; Xu, Yaohua.
IEEE Transactions on Electron Devices.  , 2024
Link: https://doi.org/10.1109/..
 
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4

Heat transfer in phase change materials for integrated batt..:

Zhang, Li ; Zhao, Huayong ; Liang, Shuibao.
Applied Thermal Engineering.  232 (2023)  - p. 120997 , 2023
Link: https://doi.org/10.1016/..
 
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5

Investigation of Electrical–Thermal–Mechanical Effects in E..:

Liang, Shuibao ; Liu, Changqing ; Jiang, Han.
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  11 - p. 1764-1769 , 2023
Link: https://doi.org/10.1109/..
 
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6

Study on PhaseElectromigration and Segregation Behavior of ..:

Liang, Shuibao ; Jiang, Han ; Huang, Jiaqiang
Journal of Electronic Materials.  53 (2023)  3 - p. 1192-1200 , 2023
Link: https://doi.org/10.1007/..
 
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7

Phase field modelling combined with data-driven approach to..:

Liang, Shuibao ; Wei, Cheng ; Kunwar, Anil...
Surfaces and Interfaces.  37 (2023)  - p. 102728 , 2023
Link: https://doi.org/10.1016/..
 
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8

Self-propagating exothermic reaction assisted Cu clip bondi..:

Liu, Canyu ; Liu, Allan ; Jiang, Han...
Microelectronics Reliability.  138 (2022)  - p. 114688 , 2022
Link: https://doi.org/10.1016/..
 
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9

Fast in-situ synchrotron X-ray imaging of the interfacial r..:

Ramachandran, S. ; Zhong, Yi ; Robertson, Stuart...
Materialia.  23 (2022)  - p. 101444 , 2022
Link: https://doi.org/10.1016/..
 
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10

Microstructural and mechanical characteristics of Cu-Sn int..:

Jiang, Han ; Robertson, Stuart ; Liang, Shuibao...
Materials Today Communications.  33 (2022)  - p. 104623 , 2022
Link: https://doi.org/10.1016/..
 
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11

Unraveling the electric field effect on the grain‐boundary ..:

Liang, Shuibao ; Zhang, Xin‐Ping
Journal of the American Ceramic Society.  106 (2022)  3 - p. 1647-1652 , 2022
Link: https://doi.org/10.1111/..
 
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12

Preferential growth of intermetallics under temperature gra..:

Liang, Shuibao ; Kunwar, Anil ; Liu, Changqing..
Journal of Materials Research and Technology.  19 (2022)  - p. 345-353 , 2022
Link: https://doi.org/10.1016/..
 
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13

Phase field study of grain boundary migration and preferent..:

Liang, Shuibao ; Liu, Changqing ; Zhou, Zhaoxia
Materials Today Communications.  31 (2022)  - p. 103408 , 2022
Link: https://doi.org/10.1016/..
 
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14

Rapid formation of intermetallic joint using Cu-Sn nanocomp..:

Jiang, Han ; Robertson, Stuart ; Liang, Shuibao...
Materials Letters.  307 (2022)  - p. 131074 , 2022
Link: https://doi.org/10.1016/..
 
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15

Investigation of thermal effect on solidification in Sn/Cu ..:

Liang, Shuibao ; Zhong, Yi ; Robertson, Stuart...
Microelectronics Reliability.  138 (2022)  - p. 114654 , 2022
Link: https://doi.org/10.1016/..
 
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