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Shie, Chuen-Kai
82
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1
Identification of the Alternative Splice Products Encoded b..:
Liu, Hsin-tzu
;
Lin, Ta-hsien
;
Kuo, Hann-chorng
...
Biochemical and Biophysical Research Communications. 291 (2002) 5 - p. 1293-1296 , 2002
Link:
https://doi.org/10.1006/..
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2
Chemical mechanical planarization of nanotwinned copper/pol..:
He, Pin-Syuan
;
Tu, Chun-Wei
;
Shie, Kai-Cheng
...
Journal of Electroanalytical Chemistry. 969 (2024) - p. 118544 , 2024
Link:
https://doi.org/10.1016/..
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3
High-Bonding-Strength Polyimide Films Achieved via Thermal ..:
He, Pin-Syuan
;
Tran, Dinh-Phuc
;
Kuo, Ting-Yu
...
Nanomaterials. 13 (2023) 9 - p. 1575 , 2023
Link:
https://doi.org/10.3390/..
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4
Stress Relaxation and Grain Growth Behaviors of (111)-Prefe..:
Lai, Jyun-Yu
;
Tran, Dinh-Phuc
;
Yang, Shih-Chi
...
Nanomaterials. 13 (2023) 4 - p. 709 , 2023
Link:
https://doi.org/10.3390/..
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5
Failures of Cu-Cu Joints under Temperature Cycling Tests:
Hsu, Po-Ning
;
Shie, Kai-Cheng
;
Tran, Dinh-Phuc
..
Materials. 15 (2022) 14 - p. 4944 , 2022
Link:
https://doi.org/10.3390/..
?
6
Effect of Tin Grain Orientation on Electromigration-Induced..:
Hsu, Po-Ning
;
Lee, Dai-Lung
;
Tran, Dinh-Phuc
...
Materials. 15 (2022) 20 - p. 7115 , 2022
Link:
https://doi.org/10.3390/..
?
7
Enhancement of fatigue resistance by recrystallization and ..:
Ong, Jia-Juen
;
Tran, Dinh-Phuc
;
Lan, Man-Chi
...
Scientific Reports. 12 (2022) 1 - p. , 2022
Link:
https://doi.org/10.1038/..
?
8
Artificial intelligence deep learning for 3D IC reliability..:
Hsu, Po-Ning
;
Shie, Kai-Cheng
;
Chen, Kuan-Peng
...
Scientific Reports. 12 (2022) 1 - p. , 2022
Link:
https://doi.org/10.1038/..
?
9
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Res..:
Ong, Jia-Juen
;
Chiu, Wei-Lan
;
Lee, Ou-Hsiang
...
Materials. 15 (2022) 5 - p. 1888 , 2022
Link:
https://doi.org/10.3390/..
?
10
Non-destructive micro analysis of electromigration failures..:
Tran, Dinh-Phuc
;
Lin, Tzu-Wen
;
Shie, Kai-Cheng
.
Materials Characterization. 194 (2022) - p. 112404 , 2022
Link:
https://doi.org/10.1016/..
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11
A kinetic model of copper-to-copper direct bonding under th..:
Shie, Kai-Cheng
;
Gusak, A.M.
;
Tu, K.N.
.
Journal of Materials Research and Technology. 15 (2021) - p. 2332-2344 , 2021
Link:
https://doi.org/10.1016/..
?
12
Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling:
Shie, Kai-Cheng
;
Hsu, Po-Ning
;
Li, Yu-Jin
..
Materials. 14 (2021) 19 - p. 5522 , 2021
Link:
https://doi.org/10.3390/..
?
13
Shearing Characteristics of Cu-Cu Joints Fabricated by Two-..:
Ong, Jia-Juen
;
Tran, Dinh-Phuc
;
Yang, Shih-Chi
..
Metals. 11 (2021) 11 - p. 1864 , 2021
Link:
https://doi.org/10.3390/..
?
14
Effect of Bonding Strength on Electromigration Failure in C..:
Shie, Kai-Cheng
;
Hsu, Po-Ning
;
Li, Yu-Jin
..
Materials. 14 (2021) 21 - p. 6394 , 2021
Link:
https://doi.org/10.3390/..
?
15
Instant Cu-to-Cu direct bonding enabled by 〈111〉-oriented n..:
Shie, Kai Cheng
;
Juang, Jing-Ye
;
Chen, Chih
Japanese Journal of Applied Physics. 59 (2019) SB - p. SBBA03 , 2019
Link:
https://doi.org/10.7567/..
1-15