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Simon-Najasek, Michél
14
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1
Analysis of Mechanical Strain in AlGaN/GaN HFETs:
Yazdani, Hossein
;
Graff, Andreas
;
Simon-Najasek, Michél
...
physica status solidi (a). 220 (2023) 16 - p. , 2023
Link:
https://doi.org/10.1002/..
?
2
Improved AlScN/GaN heterostructures grown by metal-organic ..:
Manz, Christian
;
Leone, Stefano
;
Kirste, Lutz
...
Semiconductor Science and Technology. 36 (2021) 3 - p. 034003 , 2021
Link:
https://doi.org/10.1088/..
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3
Adaptive low-temperature covalent bonding of III-nitride th..:
Gerrer, Thomas
;
Graff, Andreas
;
Simon-Najasek, Michél
...
Applied Physics Letters. 114 (2019) 25 - p. , 2019
Link:
https://doi.org/10.1063/..
?
4
Advanced FIB sample preparation techniques for high resolut..:
Simon-Najasek, Michél
;
Huebner, Susanne
;
Altmann, Frank
.
Microelectronics Reliability. 54 (2014) 9-10 - p. 1785-1789 , 2014
Link:
https://doi.org/10.1016/..
?
5
Novel techniques for dopant contrast analysis on real IC st..:
Jatzkowski, Joerg
;
Simon-Najasek, Michél
;
Altmann, Frank
Microelectronics Reliability. 52 (2012) 9-10 - p. 2098-2103 , 2012
Link:
https://doi.org/10.1016/..
?
6
Novel approach of combined planar and cross-sectional defec..:
Graff, A.
;
Simon-Najasek, M.
;
Hübner, S.
...
Microelectronics Reliability. 150 (2023) - p. 115096 , 2023
Link:
https://doi.org/10.1016/..
?
7
Local metal segregation as root cause for electrical shorts..:
Simon-Najasek, M.
;
Diehle, P.
;
Große, Ch.
...
Microelectronics Reliability. 126 (2021) - p. 114235 , 2021
Link:
https://doi.org/10.1016/..
?
8
Non-invasive soft breakdown localisation in low k dielectri..:
Herfurth, N.
;
Wu, C.
;
Beyreuther, A.
...
Microelectronics Reliability. 92 (2019) - p. 73-78 , 2019
Link:
https://doi.org/10.1016/..
?
9
Comparison of reliability of 100 nm AlGaN/GaN HEMTs with T-..:
Dammann, M.
;
Baeumler, M.
;
Brückner, P.
...
Microelectronics Reliability. 88-90 (2018) - p. 385-388 , 2018
Link:
https://doi.org/10.1016/..
?
10
Reliability of 100 nm AlGaN/GaN HEMTs for mm-wave applicati..:
Dammann, M.
;
Baeumler, M.
;
Polyakov, V.
...
Microelectronics Reliability. 76-77 (2017) - p. 292-297 , 2017
Link:
https://doi.org/10.1016/..
?
11
High resolution physical analysis of ohmic contact formatio..:
Graff, A.
;
Simon-Najasek, M.
;
Altmann, F.
...
Microelectronics Reliability. 76-77 (2017) - p. 338-343 , 2017
Link:
https://doi.org/10.1016/..
?
12
Novel failure mode of chip corrosion at automotive HALL sen..:
Simon-Najasek, M.
;
Lorenz, G.
;
Lindner, A.
.
Microelectronics Reliability. 64 (2016) - p. 248-253 , 2016
Link:
https://doi.org/10.1016/..
?
13
Detection and analysis of stress-induced voiding in Al-powe..:
Brand, S.
;
Simon-Najasek, M.
;
Kögel, M.
...
Microelectronics Reliability. 64 (2016) - p. 341-345 , 2016
Link:
https://doi.org/10.1016/..
?
14
Correlation of gate leakage and local strain distribution i..:
Broas, M.
;
Graff, A.
;
Simon-Najasek, M.
...
Microelectronics Reliability. 64 (2016) - p. 541-546 , 2016
Link:
https://doi.org/10.1016/..
1-14