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Wu, Houya
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1

Fast Filling of Microvia by Pre-Settling Particles and Foll..:

Li, Ganglong ; Li, Zhiyi ; Li, Junjie.
Nanomaterials.  12 (2022)  10 - p. 1699 , 2022
Link: https://doi.org/10.3390/..
 
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2

Cu-Cu joint formation by low-temperature sintering of self-..:

Yuan, Yulei ; Wu, Houya ; Li, Junjie..
Applied Surface Science.  570 (2021)  - p. 151220 , 2021
Link: https://doi.org/10.1016/..
 
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3

Surface Decoration of Cetyltrimethyl Ammonium Bromide on Si..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan.
The Journal of Physical Chemistry B.  125 (2021)  18 - p. 4874-4882 , 2021
Link: https://doi.org/10.1021/..
 
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4

Communication—Effects of Molecular Structures of Quaternary..:

Li, Zhiyi ; Wu, Houya ; Wang, Yan.
Journal of The Electrochemical Society.  168 (2021)  10 - p. 102506 , 2021
Link: https://doi.org/10.1149/..
 
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5

Investigations of the electrochemical performance and filli..:

Wu, Houya ; Wang, Yan ; Li, Zhiyi.
Scientific Reports.  10 (2020)  1 - p. , 2020
Link: https://doi.org/10.1038/..
 
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6

Communication—Fast Bottom-Up Filling of High Aspect Ratio M..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan.
Journal of The Electrochemical Society.  167 (2020)  13 - p. 132507 , 2020
Link: https://doi.org/10.1149/..
 
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7

Experimental Analysis of the Co-Deposition of Metal Cu and ..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan...
Journal of The Electrochemical Society.  166 (2019)  8 - p. D237-D243 , 2019
Link: https://doi.org/10.1149/..
 
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8

Inhibition Effect of CTAB on Electrodeposition of Cu in Mic..:

Wu, Houya ; Li, Zhiyi ; Wang, Yan..
Journal of The Electrochemical Society.  166 (2019)  15 - p. D816-D825 , 2019
Link: https://doi.org/10.1149/..
 
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