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Linten, Dimitri
16
results:
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1
Fast & Accurate Methodology for Aging Incorporation in Circ..:
Mishra, Subrat
;
Weckx, Pieter
;
Lin, Ji-Yung
...
info:eu-repo/grantAgreement/EC/H2020/843546/. , 2020
Link:
https://zenodo.org/recor..
?
2
Electrostatic discharge robustness of amorphous indium-gall..:
Simicic, Marko
;
Ashif, Nowab Reza
;
Hellings, Geert
...
info:eu-repo/grantAgreement/EC/H2020/716426/. , 2020
Link:
https://zenodo.org/recor..
?
3
Correlated Time-0 and Hot-Carrier Stress Induced FinFET Par..:
Makarov, Alexander
;
Roussel, Philippe
;
Bury, Erik
...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC7407495/. , 2020
Link:
http://www.ncbi.nlm.nih...
?
4
ESD study on a-IGZO TFT device architectures:
Simicic Marko
;
Hellings Geert
;
Chen Shih-Hung
..
info:eu-repo/grantAgreement/EC/H2020/716426/. , 2018
Link:
https://zenodo.org/recor..
?
5
A Cautionary Note When Looking for a Truly Reconfigurable R..:
Chuang, Kai-Hsin
;
Degraeve, Robin
;
Fantini, Andrea
...
https://tches.iacr.org/index.php/TCHES/article/view/834/786. , 2018
Link:
https://tches.iacr.org/i..
?
6
Two-step interconnect testing of semiconductor dies:
Ryckaert, Julien
;
Marinissen, EJ Erik Jan
;
Linten, Dimitri
, 2014
Link:
http://repository.tue.nl..
?
7
Two-step interconnect testing of semiconductor dies:
Ryckaert, Julien
;
Marinissen, EJ Erik Jan
;
Linten, Dimitri
, 2014
Link:
http://repository.tue.nl..
?
8
Advanced ESD power clamp design for SOI FinFET CMOS technol..:
Thijs, Steven
;
Trémouilles, David
;
Linten, Dimitri
...
info:eu-repo/semantics/altIdentifier/doi/10.1109/ICICDT.2010.5510299. , 2010
Link:
https://hal.science/hal-..
?
9
Advanced ESD power clamp design for SOI FinFET CMOS technol..:
Thijs, Steven
;
Trémouilles, David
;
Linten, Dimitri
...
info:eu-repo/semantics/altIdentifier/doi/10.1109/ICICDT.2010.5510299. , 2010
Link:
https://hal.science/hal-..
?
10
Advanced ESD power clamp design for SOI FinFET CMOS technol..:
Thijs, Steven
;
Trémouilles, David
;
Linten, Dimitri
...
info:eu-repo/semantics/altIdentifier/doi/10.1109/ICICDT.2010.5510299. , 2010
Link:
https://hal.archives-ouv..
?
11
Physical Modeling the Impact of Self-Heating on Hot-Carrier..:
Stanislav Tyaginov
;
Alexander Makarov
;
Erik Bury
...
info:eu-repo/grantAgreement/EC/H2020/794950/. , 2020
Link:
https://zenodo.org/recor..
?
12
Correlated Time-0 and Hot-Carrier Stress Induced FinFET Par..:
Alexander Makarov
;
Philippe Roussel
;
Erik Bury
...
https://dx.doi.org/10.3390/mi11070657. , 2020
Link:
https://doi.org/10.3390/..
?
13
Correlated Time-0 and Hot-Carrier Stress Induced FinFET Par..:
Alexander Makarov
;
Philippe Roussel
;
Erik Bury
...
https://www.mdpi.com/2072-666X/11/7/657. , 2020
Link:
https://doi.org/10.3390/..
?
14
Thermal stability analysis and modelling of advanced perpen..:
Simon Van Beek
;
Koen Martens
;
Philippe Roussel
...
http://dx.doi.org/10.1063/1.5007690. , 2018
Link:
https://doi.org/10.1063/..
?
15
A Cautionary Note When Looking for a Truly Reconfigurable R..:
Kai-Hsin Chuang
;
Robin Degraeve
;
Andrea Fantini
...
https://tches.iacr.org/index.php/TCHES/article/view/834. , 2018
Link:
https://doi.org/10.13154..
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