Mertin, V
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Microstructural and mechanical characterization of Cu/Sn SL..:

Emadi, F ; Vuorinen, V ; Mertin, S..
Emadi , F , Vuorinen , V , Mertin , S , Widell , K & Paulasto-Kröckel , M 2022 , ' Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer ' , Journal of Alloys and Compounds , vol. 929 , 167228 . https://doi.org/10.1016/j.jallcom.2022.167228.  , 2022
 
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